187 matches found
Buffer overflow
The Bluetooth Low Energy implementation on Dialog Semiconductor SDK through 5.0.4 for DA14580/1/2/3 devices does not properly restrict the L2CAP payload length, allowing attackers in radio range to cause a buffer overflow via a crafted Link Layer packet...
Buffer overflow
The Bluetooth Low Energy implementation on Dialog Semiconductor SDK through 1.0.14.1081 for DA1468x devices responds to link layer packets with a payload length larger than expected, allowing attackers in radio range to cause a buffer overflow via a crafted packet. This affects, for example, Augu...
CVE-2019-17518
The Bluetooth Low Energy implementation on Dialog Semiconductor SDK through 1.0.14.1081 for DA1468x devices responds to link layer packets with a payload length larger than expected, allowing attackers in radio range to cause a buffer overflow via a crafted packet. This affects, for example, Augu...
CVE-2019-17518
Vulnerability: CVE-2019-17518 affects Dialog Semiconductor BLE SDK (DA1468x) up to version 1.0.14.1081. Root cause: Bluetooth Low Energy link-layer processing accepts a payload length larger than expected, triggering a buffer overflow. Impact: attackers in radio range can exploit crafted packets ...
CVE-2019-17517
The Bluetooth Low Energy implementation on Dialog Semiconductor SDK through 5.0.4 for DA14580/1/2/3 devices does not properly restrict the L2CAP payload length, allowing attackers in radio range to cause a buffer overflow via a crafted Link Layer packet...
CVE-2019-17517
The CVE-2019-17517 entry concerns Dialog Semiconductor BLE: the L2CAP payload length is not properly restricted in the BLE stack implemented in the DA14580/DA14583 devices (SDK up to 5.0.4). Root cause: insufficient validation during Link Layer processing of L2CAP packets. Impact: potential buffe...
CVE-2019-17518
The Bluetooth Low Energy implementation on Dialog Semiconductor SDK through 1.0.14.1081 for DA1468x devices responds to link layer packets with a payload length larger than expected, allowing attackers in radio range to cause a buffer overflow via a crafted packet. This affects, for example, Augu...
CVE-2019-17517
The Bluetooth Low Energy implementation on Dialog Semiconductor SDK through 5.0.4 for DA14580/1/2/3 devices does not properly restrict the L2CAP payload length, allowing attackers in radio range to cause a buffer overflow via a crafted Link Layer packet. Recent assessments: pbarry25 at April 25,...
Marvell Avastar wireless SoCs have multiple vulnerabilities
Overview Some Marvell Avastar wireless system on chip SoC models have multiple vulnerabilities, including a block pool overflow during Wi-Fi network scan. Description A presentation at the ZeroNights 2018 conference describes multiple security issues with Marvell Avastar SoCs models 88W8787,...
Immedia Semiconductor BlinkForHome Sync Module Denial of Service Vulnerability
Immedia Semiconductor BlinkForHome Sync Module is a synchronization module for use in home security camera systems from Immedia Semiconductor. A denial of service vulnerability exists in Immedia Semiconductor BlinkForHome Sync Module version 2.10.4 and prior versions, which can be exploited by an...
Black Hat 2018: Mixed Signal Microcontrollers Open to Side-Channel Attacks
LAS VEGAS – Mixed signal circuits – in which chips isolate digital and analog components – are opening chips up to novel side-channel attacks, researchers said at Black Hat 2018 today. As chip manufacturers search for smaller and cheaper microelectronics components, they have adopted a mixed-sign...
TSMC Chip Maker Blames WannaCry Malware for Production Halt
Taiwan Semiconductor Manufacturing Company TSMC—the world's largest makers of semiconductors and processors—was forced to shut down several of its chip-fabrication factories over the weekend after being hit by a computer virus. Now, it turns out that the computer virus outbreak at Taiwan chipmake...
iPhone Chip Supplier TSMC Stops Production After Computer Virus Attack
Taiwan Semiconductor Manufacturing Company TSMC—Apple's sole supplier of SoC components for iPhones and iPads, and Qualcomm's major manufacturing partner—shut down several of its chip-fabrication factories Friday night after being hit by a computer virus. The world's largest makers of...
For NXP I. MX microprocessor HAB vulnerability analysis-vulnerability warning-the black bar safety net
One, Foreword NXP（NXP）semiconductor production company i. The MX Series application processor of the Secure Boot features in the presence of two vulnerabilities, two vulnerabilities by Quarkslab the two researchers Guillaume Delugré and Kévin Szkudłapski found this article on the two vulnerabilit...
nRF24 Playset - Software tools for Nordic Semiconductor nRF24-based Devices like Wireless Keyboards, Mice, and Presenters
The nRF24 Playset is a collection of software tools for wireless input devices like keyboards, mice, and presenters based on Nordic Semiconductor nRF24 transceivers, e.g. nRF24LE1 and nRF24LU1+. All software tools support USB dongles with the nrf-research-firmware by the Bastille Threat...
Japan's Softbank buys semiconductor giant ARM for $32 Billion in Cash
Japanese telecommunication giant SoftBank has confirmed that the company intends to acquire UK chip designer ARM Holdings for almost $32 Billion £24.3 Billion in an all-cash deal. ARM has also agreed to this offer from SoftBank and said that its board would recommend the all-cash deal to...
Lattice-Semiconductor-PAC-Designer-6.21
Exploit: Lattice Semiconductor PAC-Designer 6.21 possibly all versions CVE: CVE-2012-2915 Author: b33f Ruben Boonen - http://www.fuzzysecurity.com/ OS: WinXP SP1 Software: http://www.latticesemi.com/products/designsoftware/pacdesigner/index.cfm filename="evil.PAC" PAC1 = """ 1 ispPAC-CLK5410D...
Lattice Semiconductor PAC-Designer 6.21 - (.PAC) Exploit
No description provided by source. !/usr/bin/python -w ------------------------------------------------------------------------------------ Exploit: Lattice Semiconductor PAC-Designer 6.21 possibly all versions CVE: CVE-2012-2915 Author: b33f Ruben Boonen - http://www.fuzzysecurity.com/ OS: WinXP...
Lattice Semiconductor PAC-Designer 6.21 Symbol Value Buffer Overflow
No description provided by source. This file is part of the Metasploit Framework and may be subject to redistribution and commercial restrictions. Please see the Metasploit Framework web site for more information on licensing and terms of use. http://metasploit.com/framework/ require 'msf/core'...
Lattice Semiconductor PAC-Designer Symbol Value Buffer Overflow - Ver2 (CVE-2012-2915)
A buffer overflow vulnerability has been reported in Lattice Semiconductor PAC-Designer. The vulnerability is due to the improper handling of validation of specially crafted pac files. Successful exploitation of this vulnerability could allow a remote attacker to execute arbitrary code on the...