CVE-2019-19196

The Bluetooth Low Energy Secure Manager Protocol SMP implementation on Telink Semiconductor BLE SDK versions before November 2019 for TLSR8x5x through 3.4.0, TLSR823x through 1.3.0, and TLSR826x through 3.3 devices accepts a pairing request with a key size greater than 16 bytes, allowing an...

CVE-2019-19196

The CVE-2019-19196 entry relates to Telink Semiconductor’s BLE SDK SMP implementation. Affected SDKs (before Nov 2019) include TLSR8x5x (up to v3.4.0), TLSR823x (up to v1.3.0), and TLSR826x (up to v3.3). The vulnerability arises when a pairing request with a key size greater than 16 bytes is acce...

CVE-2019-19196

The Bluetooth Low Energy Secure Manager Protocol SMP implementation on Telink Semiconductor BLE SDK versions before November 2019 for TLSR8x5x through 3.4.0, TLSR823x through 1.3.0, and TLSR826x through 3.3 devices accepts a pairing request with a key size greater than 16 bytes, allowing an...

CVE-2019-19194

The Bluetooth Low Energy Secure Manager Protocol SMP implementation on Telink Semiconductor BLE SDK versions before November 2019 for TLSR8x5x through 3.4.0, TLSR823x through 1.3.0, and TLSR826x through 3.3 devices installs a zero long term key LTK if an out-of-order link-layer encryption request...

CVE-2019-17517

The Bluetooth Low Energy implementation on Dialog Semiconductor SDK through 5.0.4 for DA14580/1/2/3 devices does not properly restrict the L2CAP payload length, allowing attackers in radio range to cause a buffer overflow via a crafted Link Layer packet...

CVE-2019-17517

The Bluetooth Low Energy implementation on Dialog Semiconductor SDK through 5.0.4 for DA14580/1/2/3 devices does not properly restrict the L2CAP payload length, allowing attackers in radio range to cause a buffer overflow via a crafted Link Layer packet...

CVE-2019-17518

The Bluetooth Low Energy implementation on Dialog Semiconductor SDK through 1.0.14.1081 for DA1468x devices responds to link layer packets with a payload length larger than expected, allowing attackers in radio range to cause a buffer overflow via a crafted packet. This affects, for example, Augu...

CVE-2019-17518

The Bluetooth Low Energy implementation on Dialog Semiconductor SDK through 1.0.14.1081 for DA1468x devices responds to link layer packets with a payload length larger than expected, allowing attackers in radio range to cause a buffer overflow via a crafted packet. This affects, for example, Augu...

Buffer overflow

The Bluetooth Low Energy implementation on Dialog Semiconductor SDK through 5.0.4 for DA14580/1/2/3 devices does not properly restrict the L2CAP payload length, allowing attackers in radio range to cause a buffer overflow via a crafted Link Layer packet...

Buffer overflow

The Bluetooth Low Energy implementation on Dialog Semiconductor SDK through 1.0.14.1081 for DA1468x devices responds to link layer packets with a payload length larger than expected, allowing attackers in radio range to cause a buffer overflow via a crafted packet. This affects, for example, Augu...

CVE-2019-17518

Vulnerability: CVE-2019-17518 affects Dialog Semiconductor BLE SDK (DA1468x) up to version 1.0.14.1081. Root cause: Bluetooth Low Energy link-layer processing accepts a payload length larger than expected, triggering a buffer overflow. Impact: attackers in radio range can exploit crafted packets ...

CVE-2019-17518

The Bluetooth Low Energy implementation on Dialog Semiconductor SDK through 1.0.14.1081 for DA1468x devices responds to link layer packets with a payload length larger than expected, allowing attackers in radio range to cause a buffer overflow via a crafted packet. This affects, for example, Augu...

CVE-2019-17517

The Bluetooth Low Energy implementation on Dialog Semiconductor SDK through 5.0.4 for DA14580/1/2/3 devices does not properly restrict the L2CAP payload length, allowing attackers in radio range to cause a buffer overflow via a crafted Link Layer packet...

CVE-2019-17517

The CVE-2019-17517 entry concerns Dialog Semiconductor BLE: the L2CAP payload length is not properly restricted in the BLE stack implemented in the DA14580/DA14583 devices (SDK up to 5.0.4). Root cause: insufficient validation during Link Layer processing of L2CAP packets. Impact: potential buffe...

CVE-2019-17518

The Bluetooth Low Energy implementation on Dialog Semiconductor SDK through 1.0.14.1081 for DA1468x devices responds to link layer packets with a payload length larger than expected, allowing attackers in radio range to cause a buffer overflow via a crafted packet. This affects, for example, Augu...

CVE-2019-17517

The Bluetooth Low Energy implementation on Dialog Semiconductor SDK through 5.0.4 for DA14580/1/2/3 devices does not properly restrict the L2CAP payload length, allowing attackers in radio range to cause a buffer overflow via a crafted Link Layer packet. Recent assessments: pbarry25 at April 25,...

Marvell Avastar wireless SoCs have multiple vulnerabilities

Overview Some Marvell Avastar wireless system on chip SoC models have multiple vulnerabilities, including a block pool overflow during Wi-Fi network scan. Description A presentation at the ZeroNights 2018 conference describes multiple security issues with Marvell Avastar SoCs models 88W8787,...

Immedia Semiconductor BlinkForHome Sync Module Denial of Service Vulnerability

Immedia Semiconductor BlinkForHome Sync Module is a synchronization module for use in home security camera systems from Immedia Semiconductor. A denial of service vulnerability exists in Immedia Semiconductor BlinkForHome Sync Module version 2.10.4 and prior versions, which can be exploited by an...

Black Hat 2018: Mixed Signal Microcontrollers Open to Side-Channel Attacks

LAS VEGAS – Mixed signal circuits – in which chips isolate digital and analog components – are opening chips up to novel side-channel attacks, researchers said at Black Hat 2018 today. As chip manufacturers search for smaller and cheaper microelectronics components, they have adopted a mixed-sign...

TSMC Chip Maker Blames WannaCry Malware for Production Halt

Taiwan Semiconductor Manufacturing Company TSMC—the world's largest makers of semiconductors and processors—was forced to shut down several of its chip-fabrication factories over the weekend after being hit by a computer virus. Now, it turns out that the computer virus outbreak at Taiwan chipmake...