CVE-2020-15509

CVE-2020-15509 affects Nordic Semiconductor Android BLE Library up to 2.2.1 and the DFU Library up to 1.10.4 (used by nRF Connect and others). The issue is unencrypted communication being presented as encrypted, originating from the bond creation path (e.g., internalCreateBond in BleManagerHandle...

CVE-2020-15509

Nordic Semiconductor Android BLE Library through 2.2.1 and DFU Library through 1.10.4 for Android as used by nRF Connect and other applications can engage in unencrypted communication while showing the user that the communication is purportedly encrypted. The problem is in bond creation e.g.,...

Wi-Fi Chip Vulnerability

There's a vulnerability in Wi-Fi hardware that breaks the encryption: The vulnerability exists in Wi-Fi chips made by Cypress Semiconductor and Broadcom, the latter a chipmaker Cypress acquired in 2016. The affected devices include iPhones, iPads, Macs, Amazon Echos and Kindles, Android devices,...

A Dozen Vulnerabilities Affect Millions of Bluetooth LE Powered Devices

A team of cybersecurity researchers late last week disclosed the existence of 12 potentially severe security vulnerabilities, collectively named 'SweynTooth ,' affecting millions of Bluetooth-enabled wireless smart devices worldwide—and worryingly, a few of which haven't yet been patched. All...

A Dozen Vulnerabilities Affect Millions of Bluetooth LE Powered Devices

A team of cybersecurity researchers late last week disclosed the existence of 12 potentially severe security vulnerabilities, collectively named 'SweynTooth,' affecting millions of Bluetooth-enabled wireless smart devices worldwide—and worryingly, a few of which haven't yet been patched. All...

CVE-2019-19196

The Bluetooth Low Energy Secure Manager Protocol SMP implementation on Telink Semiconductor BLE SDK versions before November 2019 for TLSR8x5x through 3.4.0, TLSR823x through 1.3.0, and TLSR826x through 3.3 devices accepts a pairing request with a key size greater than 16 bytes, allowing an...

CVE-2019-19194

The Bluetooth Low Energy Secure Manager Protocol SMP implementation on Telink Semiconductor BLE SDK versions before November 2019 for TLSR8x5x through 3.4.0, TLSR823x through 1.3.0, and TLSR826x through 3.3 devices installs a zero long term key LTK if an out-of-order link-layer encryption request...

CVE-2019-19196

The Bluetooth Low Energy Secure Manager Protocol SMP implementation on Telink Semiconductor BLE SDK versions before November 2019 for TLSR8x5x through 3.4.0, TLSR823x through 1.3.0, and TLSR826x through 3.3 devices accepts a pairing request with a key size greater than 16 bytes, allowing an...

Buffer overflow

The Bluetooth Low Energy Secure Manager Protocol SMP implementation on Telink Semiconductor BLE SDK versions before November 2019 for TLSR8x5x through 3.4.0, TLSR823x through 1.3.0, and TLSR826x through 3.3 devices accepts a pairing request with a key size greater than 16 bytes, allowing an...

Design/Logic Flaw

The Bluetooth Low Energy Secure Manager Protocol SMP implementation on Telink Semiconductor BLE SDK versions before November 2019 for TLSR8x5x through 3.4.0, TLSR823x through 1.3.0, and TLSR826x through 3.3 devices installs a zero long term key LTK if an out-of-order link-layer encryption request...

CVE-2019-19194

The Bluetooth Low Energy Secure Manager Protocol SMP implementation on Telink Semiconductor BLE SDK versions before November 2019 for TLSR8x5x through 3.4.0, TLSR823x through 1.3.0, and TLSR826x through 3.3 devices installs a zero long term key LTK if an out-of-order link-layer encryption request...

CVE-2019-19194

The CVE-2019-19194 issue affects Telink Semiconductor BLE SDKs (TLSR8x5x up to 3.4.0; TLSR823x up to 1.3.0; TLSR826x up to 3.3) when Secure Connections pairing is in use. The Bluetooth Low Energy SMP implementation can install a zero long-term key (LTK) if an out-of-order link-layer encryption re...

CVE-2019-19196

The Bluetooth Low Energy Secure Manager Protocol SMP implementation on Telink Semiconductor BLE SDK versions before November 2019 for TLSR8x5x through 3.4.0, TLSR823x through 1.3.0, and TLSR826x through 3.3 devices accepts a pairing request with a key size greater than 16 bytes, allowing an...

CVE-2019-19196

The CVE-2019-19196 entry relates to Telink Semiconductor’s BLE SDK SMP implementation. Affected SDKs (before Nov 2019) include TLSR8x5x (up to v3.4.0), TLSR823x (up to v1.3.0), and TLSR826x (up to v3.3). The vulnerability arises when a pairing request with a key size greater than 16 bytes is acce...

CVE-2019-19196

The Bluetooth Low Energy Secure Manager Protocol SMP implementation on Telink Semiconductor BLE SDK versions before November 2019 for TLSR8x5x through 3.4.0, TLSR823x through 1.3.0, and TLSR826x through 3.3 devices accepts a pairing request with a key size greater than 16 bytes, allowing an...

CVE-2019-19194

The Bluetooth Low Energy Secure Manager Protocol SMP implementation on Telink Semiconductor BLE SDK versions before November 2019 for TLSR8x5x through 3.4.0, TLSR823x through 1.3.0, and TLSR826x through 3.3 devices installs a zero long term key LTK if an out-of-order link-layer encryption request...

CVE-2019-17518

The Bluetooth Low Energy implementation on Dialog Semiconductor SDK through 1.0.14.1081 for DA1468x devices responds to link layer packets with a payload length larger than expected, allowing attackers in radio range to cause a buffer overflow via a crafted packet. This affects, for example, Augu...

CVE-2019-17517

The Bluetooth Low Energy implementation on Dialog Semiconductor SDK through 5.0.4 for DA14580/1/2/3 devices does not properly restrict the L2CAP payload length, allowing attackers in radio range to cause a buffer overflow via a crafted Link Layer packet...

CVE-2019-17517

The Bluetooth Low Energy implementation on Dialog Semiconductor SDK through 5.0.4 for DA14580/1/2/3 devices does not properly restrict the L2CAP payload length, allowing attackers in radio range to cause a buffer overflow via a crafted Link Layer packet...

CVE-2019-17518

The Bluetooth Low Energy implementation on Dialog Semiconductor SDK through 1.0.14.1081 for DA1468x devices responds to link layer packets with a payload length larger than expected, allowing attackers in radio range to cause a buffer overflow via a crafted packet. This affects, for example, Augu...