CVE-2019-16863

STMicroelectronics ST33TPHF2ESPI TPM devices before 2019-09-12 allow attackers to extract the ECDSA private key via a side-channel timing attack because ECDSA scalar multiplication is mishandled, aka TPM-FAIL...

Trusted Platform Module CVE-2019-16863 Unspecified Security Vulnerability

Description Trusted Platform Module is prone to an unspecified security vulnerability. Successfully exploiting this issue will allow attackers to perform unauthorized actions; this may aid in launching further attacks. Technologies Affected STMicroelectronics Trusted Platform Module Trusted...

ST Microelectronics TPM Firmware ECDSA Signature Generation Vulnerability - Lenovo Support US

Lenovo Security Advisory: LEN-29406 Potential Impact: Information Disclosure Severity: High Scope of Impact: Industry-wide CVE Identifier: CVE-2019-16863 Summary Description: ST Microelectronics has reported a vulnerability in the implementation of the Elliptic Digital Signature Algorithm ECDSA...

ST Microelectronics TPM Firmware ECDSA Signature Generation Vulnerability - Lenovo Support US

No description provided...