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ST Microelectronics TPM Firmware ECDSA Signature Generation Vulnerability - Lenovo Support US
| Reporter | Title | Published | Views | Family All 15 |
|---|---|---|---|---|
 | CVE-2019-16863 | 13 Nov 201916:55 | – | circl |
 | STMicroelectronics ST33TPHF2ESPI TPM Encryption Issue Vulnerability | 17 Dec 201900:00 | – | cnvd |
 | CVE-2019-16863 | 14 Nov 201902:07 | – | cve |
 | CVE-2019-16863 | 14 Nov 201902:07 | – | cvelist |
 | EUVD-2019-7373 | 7 Oct 202500:30 | – | euvd |
 | K32412503: Trusted Platform Module vulnerabilities CVE-2019-11090 and CVE-2019-16863 | 21 Feb 202319:57 | – | f5 |
 | ST Microelectronics TPM Firmware ECDSA Signature Generation Vulnerability - Lenovo Support US | 9 Nov 201913:22 | – | lenovo |
 | Microsoft Guidance for Vulnerability in Trusted Platform Module (TPM) | 12 Nov 201908:00 | – | mscve |
 | CVE-2019-16863 | 14 Nov 201903:15 | – | nvd |
 | CVE-2019-16863 | 14 Nov 201903:15 | – | osv |
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10 Sep 2020 13:33Current
5.6Medium risk
Vulners AI Score5.6
EPSS0.00339