Linux kernel IPv6 DoS

The vulnerability of the Linux operating system’s IPv6 kernel component relates to the copying of buffers without checking the input data. Exploiting this vulnerability allows a remote attacker to compromise the confidentiality, integrity, and accessibility of the protected information...

FFmpeg libavformat parse_options Heap Buffer Overflow DoS

The vulnerability of the parseoptions function in the sbgdec.c component of the libavformat module of the FFmpeg multimedia library is related to the copying of buffers without checking the input data. Exploiting this vulnerability could allow a remote attacker to cause service interruptions...

AutoCAD simulation Code Execution

The vulnerability in the acdb25.dll file of the AutoCAD modeling, design, and drawing software relates to the copying of buffers without checking the size of the input data. Exploiting this vulnerability allows an attacker to execute arbitrary code within the context of the current process while...

Oracle VM VirtualBox Core Component Code Execution

The vulnerability of the Core component of the Oracle VM VirtualBox software lies in the copying of buffers without checking the size of the input data. Exploiting this vulnerability allows an attacker to execute arbitrary code and increase their privileges...

ArubaOS DoS

The vulnerability in the web interface of ArubaOS relates to the copying of buffers without checking the size of the input data. Exploiting this vulnerability can allow a malicious actor, operating remotely, to cause service interruptions...

Emscripten HEIF AVIF DoS

The vulnerability of the Emscripten compiler in the library for encoding and decoding HEIF and AVIF files is related to the copying of buffers without checking the size of the input data during image processing using the strided function. Exploiting this vulnerability can allow an attacker to cau...

Qualcomm 芯片缓冲区错误漏洞

A Qualcomm chip is a chip from Qualcomm Incorporated USA. A way to miniaturize circuitry mainly semiconductor devices, but also passive components, etc. and is often fabricated on the surface of semiconductor wafers. The Qualcomm chip suffers from a security vulnerability that stems from memory...