CVE-2021-46759

Improper syscall input validation in AMD TEE Trusted Execution Environment may allow an attacker with physical access and control of a Uapp that runs under the bootloader to reveal the contents of the ASP AMD Secure Processor bootloader accessible memory to a serial port, resulting in a potential...

CVE-2021-46759

Improper syscall input validation in AMD TEE Trusted Execution Environment may allow an attacker with physical access and control of a Uapp that runs under the bootloader to reveal the contents of the ASP AMD Secure Processor bootloader accessible memory to a serial port, resulting in a potential...

Client Vulnerabilities – May 2023

Bulletin ID: AMD-SB-4001 Potential Impact: Varies by CVE, see descriptions below Severity: Varies by CVE, see descriptions below Summary Potential vulnerabilities in AMD Secure Processor ASP, AMD System Management Unit SMU, and other platform components were discovered, and mitigations are being...

UNISOC Chipsets 缓冲区错误漏洞

UNISOC Chipsets is a chipset from China's Unisplendour UNISOC. A security vulnerability exists in the UNISOC Chipsets tee service module, which stems from a lack of boundary checking, resulting in out-of-bounds writes...

CVE-2022-33273

Information disclosure due to buffer over-read in Trusted Execution Environment while QRKS report generation...

Information disclosure

Information disclosure due to buffer over-read in Trusted Execution Environment while QRKS report generation...

CVE-2022-33273

CVE-2022-33273 : Information disclosure due to a buffer over-read in the Trusted Execution Environment during QRKS report generation. Affected component: Qualcomm Trusted Execution Environment ; root cause: buffer over-read in the QRKS report path. Impact: confidentiality leakage (high); attack v...

CVE-2022-33273 Buffer over-read in Trusted Execution Environment

Information disclosure due to buffer over-read in Trusted Execution Environment while QRKS report generation...

Qualcomm 芯片缓冲区错误漏洞

A Qualcomm chip is a chip from Qualcomm Incorporated USA. A way of miniaturizing circuits mainly semiconductor devices, but also passive components, etc., and are often manufactured on the surface of semiconductor wafers. A security vulnerability exists in the Qualcomm chip that stems from a buff...

PT-2023-13279 · Unknown · Trusted Execution Environment

Name of the Vulnerable Software and Affected Versions: Trusted Execution Environment affected versions not specified Description: The issue is related to information disclosure due to a buffer over-read in the Trusted Execution Environment, specifically during QRKS report generation...

CVE-2022-33221

Information disclosure in Trusted Execution Environment due to buffer over-read while processing metadata verification requests...

CVE-2022-33221

CVE-2022-33221 describes an information disclosure via a buffer over-read in the Trusted Execution Environment when processing metadata verification requests. Multiple connected sources attribute the issue to Qualcomm closed-source components/T EE; impact is confidentiality loss with potential lo...

CVE-2022-33221 Buffer over-read in Trusted Execution Environment

Information disclosure in Trusted Execution Environment due to buffer over-read while processing metadata verification requests...

PT-2023-13243 · Unknown · Trusted Execution Environment

Name of the Vulnerable Software and Affected Versions: Trusted Execution Environment affected versions not specified Description: The issue is related to information disclosure in the Trusted Execution Environment. It occurs due to a buffer over-read when processing metadata verification requests...

CVE-2021-46795

A TOCTOU time-of-check to time-of-use vulnerability exists where an attacker may use a compromised BIOS to cause the TEE OS to read memory out of bounds that could potentially result in a denial of service...

Design/Logic Flaw

An unprotected memory-access operation in opteeos in TrustedFirmware Open Portable Trusted Execution Environment OP-TEE before 3.20 allows a physically proximate adversary to bypass signature verification and install malicious trusted applications via electromagnetic fault injections...

CVE-2022-47549

The vulnerability CVE-2022-47549 affects OP-TEE within TrustedFirmware (OP-TEE) prior to version 3.20. The root cause is an unprotected memory-access operation in optee_os that enables a physically proximate attacker to bypass signature verification and install malicious trusted applications thro...

OP-TEE Trusted OS Buffer Overflow Vulnerability

OP-TEE Trusted OS is OP-TEE open source an open source trusted execution environment TEE that implements Arm TrustZone technology. A buffer overflow vulnerability exists in OP-TEE Trusted OS versions prior to 3.19.0, which stems from an unvalidated "numparams" parameter that can be exploited to...

CVE-2022-46152

OP-TEE Trusted OS is the secure side implementation of OP-TEE project, a Trusted Execution Environment. Versions prior to 3.19.0, contain an Improper Validation of Array Index vulnerability. The function cleanupshmrefs is called by both entryinvokecommand and entryopensession. The commands...

Input validation

OP-TEE Trusted OS is the secure side implementation of OP-TEE project, a Trusted Execution Environment. Versions prior to 3.19.0, contain an Improper Validation of Array Index vulnerability. The function cleanupshmrefs is called by both entryinvokecommand and entryopensession. The commands...