751 matches found
CVE-2018-11847
CVE-2018-11847: A vulnerability where a malicious TA can tag QSEE kernel memory and map it into EL0, enabling corruption of physical memory and the QSEE kernel, effectively compromising the entire TEE. Affected platforms include Snapdragon Auto, Compute, Connectivity, Consumer Electronics Connect...
CVE-2018-11847: Improper Input Validation
Malicious TA can tag QSEE kernel memory and map to EL0, there by corrupting the physical memory as well it can be used to corrupt the QSEE kernel and compromise the whole TEE in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon...
CVE-2017-18320
QSEE unload attempt on a 3rd party TEE without previously loading results in a data abort in snapdragon automobile and snapdragon mobile in versions MSM8996AU, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 650/52, SD 712 / SD 710 ...
Code injection
When a 3rd party TEE has been loaded it is possible for the non-secure world to create a secure monitor call which will give it access to privileged functions meant to only be accessible from the TEE in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear in versions IPQ8074, MDM9206,...
CVE-2017-18141
When a 3rd party TEE has been loaded it is possible for the non-secure world to create a secure monitor call which will give it access to privileged functions meant to only be accessible from the TEE in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear in versions IPQ8074, MDM9206,...
Code injection
QSEE unload attempt on a 3rd party TEE without previously loading results in a data abort in snapdragon automobile and snapdragon mobile in versions MSM8996AU, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 650/52, SD 712 / SD 710 ...
CVE-2017-18141
When a 3rd party TEE has been loaded it is possible for the non-secure world to create a secure monitor call which will give it access to privileged functions meant to only be accessible from the TEE in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear in versions IPQ8074, MDM9206,...
CVE-2017-18320
CVE-2017-18320 describes a data abort in QSEE when unloading on a third-party TEE without prior loading, affecting Qualcomm Snapdragon automotive/mobile platforms across numerous SoCs (e.g., MSM8996AU, SD 410/12, 820, 835, 650/52, 710/670, 810, 820A, 835, 660, several SDM/SXR variants). The linke...
CVE-2017-18141
CVE-2017-18141 describes a local elevation of privilege in Qualcomm closed‑source components used across many Snapdragon platforms (e.g., IPQ8074, MDM9xxx, SDx and related SoCs) where loading a third‑party TEE enables the non‑secure world to invoke a secure monitor call to access privileged funct...
CVE-2017-18320: Improper Input Validation
QSEE unload attempt on a 3rd party TEE without previously loading results in a data abort in snapdragon automobile and snapdragon mobile in versions MSM8996AU, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 650/52, SD 712 / SD 710 ...
CVE-2018-11847
Malicious TA can tag QSEE kernel memory and map to EL0, there by corrupting the physical memory as well it can be used to corrupt the QSEE kernel and compromise the whole TEE in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon...
CVE-2017-18141
When a 3rd party TEE has been loaded it is possible for the non-secure world to create a secure monitor call which will give it access to privileged functions meant to only be accessible from the TEE in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear in versions IPQ8074, MDM9206,...
CVE-2017-18297
Double memory free while closing TEE SE API Session management in Snapdragon Mobile in version SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820...
Double free
Double memory free while closing TEE SE API Session management in Snapdragon Mobile in version SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820...
CVE-2017-18297
CVE-2017-18297 affects Qualcomm closed‑source components in Snapdragon Mobile (SD 425/430/450/625/650/52/820). The root cause is a double free of memory during closure of the TEE SE API Session management. Impact is described as high in the linked sources, with local attack vector and complete co...
CVE-2017-18297
Double memory free while closing TEE SE API Session management in Snapdragon Mobile in version SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820...
CVE-2017-18297: Double Free
Double memory free while closing TEE SE API Session management in Snapdragon Mobile in version SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820...
Memory corruption
In Android before the 2018-05-05 security patch level, NVIDIA Trusted Execution Environment TEE contains a memory corruption due to unusual root cause vulnerability, which if run within the speculative execution of the TEE, may lead to local escalation of privileges. This issue is rated as...
CVE-2017-6289
The CVE-2017-6289 issue affects NVIDIA Tegra TZ/Tee components exposed to the Android SHIELD TV platform. The connected NVIDIA security bulletin describes a vulnerability in the Tegra kernel driver that could allow a local malicious application to execute arbitrary code within the Trusted Executi...
CVE-2017-6289: Improper Restriction of Operations within the Bounds of a Memory Buffer
In Android before the 2018-05-05 security patch level, NVIDIA Trusted Execution Environment TEE contains a memory corruption due to unusual root cause vulnerability, which if run within the speculative execution of the TEE, may lead to local escalation of privileges. This issue is rated as...