Qualcomm Innovation Center Android contributions for MSM stack buffer overflow vulnerability

Qualcomm Innovation Center Android contributions for MSM is a Qualcomm chip product used in the MSM program to support users in building Android-based platforms and include other enhancements; MSM Thermal driver for the Linux kernel is a Thermal driver for the Linux kernel. QuIC Android...

CVE-2016-2063

Stack-based buffer overflow in the supplylminputwrite function in drivers/thermal/supplylmcore.c in the MSM Thermal driver for the Linux kernel 3.x, as used in Qualcomm Innovation Center QuIC Android contributions for MSM devices and other products, allows attackers to cause a denial of service o...

Stack overflow

Stack-based buffer overflow in the supplylminputwrite function in drivers/thermal/supplylmcore.c in the MSM Thermal driver for the Linux kernel 3.x, as used in Qualcomm Innovation Center QuIC Android contributions for MSM devices and other products, allows attackers to cause a denial of service o...

CVE-2016-2063: Improper Restriction of Operations within the Bounds of a Memory Buffer

Stack-based buffer overflow in the supplylminputwrite function in drivers/thermal/supplylmcore.c in the MSM Thermal driver for the Linux kernel 3.x, as used in Qualcomm Innovation Center QuIC Android contributions for MSM devices and other products, allows attackers to cause a denial of service o...