CVE-2017-18328

Use after free in QSH client rule processing in snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 636, SD 820, SD 835, SDA660, SDM630, SDM660,...

CVE-2017-18330

Buffer overflow in AES-CCM and AES-GCM encryption via initialization vector in snapdragon automobile, snapdragon mobile and snapdragon wear in versions IPQ8074, MDM9206, MDM9607, MDM9635M, MDM9640, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD...

CVE-2017-18323

Cryptographic key material leaked in TDSCDMA RRC debug messages in snapdragon automobile, snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9615, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 430, SD 450, SD...

CVE-2017-18328

CVE-2017-18328 describes a use-after-free in the QSH client rule processing on Qualcomm Snapdragon mobile/wear platforms (MDM/SDM/SoC families listed). Documented impact is high local vulnerability with potential for complete confidentiality, integrity, and availability compromise if exploited. N...

CVE-2017-18321

CVE-2017-18321 affects Snapdragon mobile devices (examples listed: MDM9650, MDM9655, SD 835, SDA660). The issue involves leakage of security keys used by the terminal and NW for a session, constituting an information-disclosure risk. Root cause details are not provided beyond the key leakage desc...

CVE-2017-18329

Possible Buffer overflow when transmitting an RTP packet in snapdragon automobile and snapdragon wear in versions MDM9615, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 636, SD...

CVE-2017-18326

Cryptographic keys are printed in modem debug messages in snapdragon mobile and snapdragon wear in versions MDM9607, MDM9615, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 636,...

CVE-2017-18141

When a 3rd party TEE has been loaded it is possible for the non-secure world to create a secure monitor call which will give it access to privileged functions meant to only be accessible from the TEE in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear in versions IPQ8074, MDM9206,...

CVE-2017-18324

Cryptographic key material leakage in debug messages affecting GERAN on Snapdragon mobile/wear (various MDM/SD/SM/SDX devices). Root cause: leakage of keys in debug output for affected Qualcomm components; CVE-2017-18324. Consequences: information disclosure with partial confidentiality impact as...

CVE-2017-18320

CVE-2017-18320 describes a data abort in QSEE when unloading on a third-party TEE without prior loading, affecting Qualcomm Snapdragon automotive/mobile platforms across numerous SoCs (e.g., MSM8996AU, SD 410/12, 820, 835, 650/52, 710/670, 810, 820A, 835, 660, several SDM/SXR variants). The linke...

CVE-2017-11004

A non-secure user may be able to access certain registers in snapdragon automobile, snapdragon mobile and snapdragon wear in versions IPQ8074, MDM9206, MDM9607, MDM9635M, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD...

CVE-2017-18327

CVE-2017-18327 concerns logging of security keys when any WCDMA call is configured or reconfigured on Qualcomm Snapdragon platforms (automotive, mobile, wear) across listed chipsets and SoCs (e.g., MDM9607, MSM8996AU, SD 210/212/205, SD 820/835/845, SDA660, etc.). The NVD entry lists affected pro...

Unspecified Vulnerability in ASUS ZenFone 3 Max (CNVD-2020-22296)

ASUS ZenFone 3 Max is an Android-based smartphone from ASUS. Pre-installation in ASUS ZenFone 3 Max Build fingerprint used is asus/USPhone/ASUSX0081:7.0/NRD90M/USPhone-14.14.1711.92-20171208:user/release-keys A security vulnerability exists in the com.asus.loguploader.LogUploaderService component...

How to take support bundle from CLI on SDWAN

Take support bundle on SD-WAN using CLI and upload it to FTP server...

Transcend Wi-Fi SD Card Directory Traversal Vulnerability

The Transcend Wi-Fi SD Card is an SD card with wireless WI-FI capability. A directory traversal vulnerability exists in Transcend Wi-Fi SD Card. An attacker can exploit the vulnerability to disclose arbitrary files...

Transcend Wi-Fi SD Card Cross Site Request Forgery / Traversal Vulnerabilities

Transcend Wi-Fi SD Card 16GB with firmware 1.8 suffers from cross site request forgery and directory traversal vulnerabilities. There are Directory Traversal and Cross-Site Request Forgery vulnerabilities in Transcend Wi-Fi SD Card. ------------------------- Affected products:...

Transcend Wi-Fi SD Card Cross Site Request Forgery / Traversal

Hello list! There are Directory Traversal and Cross-Site Request Forgery vulnerabilities in Transcend Wi-Fi SD Card. ------------------------- Affected products: ------------------------- Vulnerable is the next model: Transcend Wi-Fi SD Card 16 GB, Firmware v.1.8. This model with other firmware...

CVE-2016-10502

While generating trusted application id, An integer overflow can occur giving the trusted application an invalid identity in Snapdragon Mobile and Snapdragon Wear in versions MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 835 and SDA660...

CVE-2016-10502

CVE-2016-10502 involves an integer overflow while generating a trusted application id, which can yield a trusted application's identity as invalid. The issue affects Qualcomm Snapdragon components on Snapdragon Mobile and Snapdragon Wear devices, specifically in versions MDM9206, MDM9607, MDM9650...

Integer overflow

While generating trusted application id, An integer overflow can occur giving the trusted application an invalid identity in Snapdragon Mobile and Snapdragon Wear in versions MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 835 and SDA660...