CVE-2017-18157

CVE-2017-18157 is described as a Use After Free condition in the Thermal Engine affecting Snapdragon Automotive, Mobile, and Wear platforms (list includes MDM9206, MDM9607, MDM9650, MSM89xx series, SD 210–835, SDX20, etc.). The connected sources corroborate the presence of a use-after-free in the...

CVE-2017-18145

CVE-2017-18145 describes a Use-After-Free condition in the DPM native process while handling Android framework events on Qualcomm Snapdragon platforms. The underlying issue is that an iterator pointer is deleted after an event is processed, which can cause a Use After Condition during processing ...