CVE-2017-18157

CVE-2017-18157 is described as a Use After Free condition in the Thermal Engine affecting Snapdragon Automotive, Mobile, and Wear platforms (list includes MDM9206, MDM9607, MDM9650, MSM89xx series, SD 210–835, SDX20, etc.). The connected sources corroborate the presence of a use-after-free in the...

Improper access control

Improper access to HLOS is possible while transferring memory to CPZ in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music in versions MDM9150,...