CVE-2017-18157

CVE-2017-18157 is described as a Use After Free condition in the Thermal Engine affecting Snapdragon Automotive, Mobile, and Wear platforms (list includes MDM9206, MDM9607, MDM9650, MSM89xx series, SD 210–835, SDX20, etc.). The connected sources corroborate the presence of a use-after-free in the...