9 matches found
PT-2026-34740
Name of the Vulnerable Software and Affected Versions Qualcomm Snapdragon chips MDM and MSM series Description A hardware-level flaw exists in the BootROM of certain legacy and mid-range Snapdragon chipsets. The issue is exposed via the Sahara protocol in Emergency Download Mode EDL, allowing an...
EUVD-2021-17258
Malware in sbrugna...
CVE-2021-30327
Buffer overflow in sahara protocol while processing commands leads to overwrite of secure configuration data in Snapdragon Mobile, Snapdragon Compute, Snapdragon Auto, Snapdragon IOT, Snapdragon Connectivity, Snapdragon Voice & Music...
CVE-2021-30327
Buffer overflow in sahara protocol while processing commands leads to overwrite of secure configuration data in Snapdragon Mobile, Snapdragon Compute, Snapdragon Auto, Snapdragon IOT, Snapdragon Connectivity, Snapdragon Voice & Music...
Buffer overflow
Buffer overflow in sahara protocol while processing commands leads to overwrite of secure configuration data in Snapdragon Mobile, Snapdragon Compute, Snapdragon Auto, Snapdragon IOT, Snapdragon Connectivity, Snapdragon Voice & Music...
CVE-2021-30327
Buffer overflow in sahara protocol while processing commands leads to overwrite of secure configuration data in Snapdragon Mobile, Snapdragon Compute, Snapdragon Auto, Snapdragon IOT, Snapdragon Connectivity, Snapdragon Voice & Music...
CVE-2021-30327
CVE-2021-30327 describes a buffer overflow in the Sahara protocol during command processing that overwrites secure configuration data in Qualcomm Snapdragon products. Affected are Snapdragon Mobile, Compute, Auto, IOT, Connectivity, and Voice & Music lines. Root cause: buffer overflow in Sahara p...
PT-2022-9990
Name of the Vulnerable Software and Affected Versions Snapdragon Mobile affected versions not specified Snapdragon Compute affected versions not specified Snapdragon Auto affected versions not specified Snapdragon IOT affected versions not specified Snapdragon Connectivity affected versions not...
多款Qualcomm产品资源管理错误漏洞
A Qualcomm chip is a chip from Qualcomm Incorporated USA. A way of miniaturizing circuits mainly semiconductor devices, but also passive components, etc., and from time to time manufactured on the surface of semiconductor wafers. A resource management error vulnerability exists in the sahara...