Memory corruption

Memory corruption in Core Platform while printing the response buffer in log...

CVE-2023-21664

CVE-2023-21664 affects Qualcomm closed-source components in the Core Platform. The issue is described as memory corruption that occurs while printing the response buffer to logs, i.e., a Core Platform memory corruption during log handling. The NVD entry lists a high impact with LOCAL access, low ...

CVE-2023-21662 Buffer Copy without Checking the Size of Input(Classic Buffer Overflow) in Core Platform

Memory corruption in Core Platform while printing the response buffer in log...

Qualcomm Chipsets Security Vulnerability

Qualcomm Chipsets are a family of chipsets from Qualcomm Incorporated USA. A security vulnerability exists in Qualcomm Chipsets that stems from a Core Platform memory corruption when the response buffer is printed in the log...

Qualcomm Chipsets Buffer Error Vulnerability

Qualcomm Chipsets are a family of chipsets from Qualcomm Incorporated USA. A security vulnerability exists in Qualcomm Chipsets that stems from a Core Platform memory corruption when printing a response buffer in a log...

PT-2023-18327 · Unknown · Core Platform

Name of the Vulnerable Software and Affected Versions: Core Platform affected versions not specified Description: The issue is related to memory corruption in the Core Platform when printing the response buffer in the log. This corruption occurs during the logging process, potentially leading to...

PT-2023-18325 · Unknown · Core Platform

Name of the Vulnerable Software and Affected Versions: Core Platform affected versions not specified Description: The issue is related to memory corruption in the Core Platform when printing the response buffer in the log. This occurs due to improper handling of the response buffer, leading to...

SUSE CVE-2015-9185

In Android before 2018-04-05 or earlier security patch level on Qualcomm Snapdragon Automobile, Snapdragon Mobile, and Snapdragon Wear MDM9206, MDM9650, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 430, SD 450, SD 600, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 800, SD 808, SD 810, SD 820, SD...

CVE-2021-35132

Out of bound write in DSP service due to improper bound check for response buffer size in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables...

Input validation

Out of bound write in DSP service due to improper bound check for response buffer size in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables...

CVE-2021-35132

Out of bound write in DSP service due to improper bound check for response buffer size in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables...

CVE-2021-35132

CVE-2021-35132 describes an out-of-bounds write in Qualcomm Snapdragon DSP service (closed-source components) caused by an improper bound check on the response buffer. Affected are multiple Snapdragon line items (Auto, Compute, Connectivity, Consumer IOT, Industrial IOT, Mobile, Wearables). The i...

PT-2022-10445 · Qualcomm · Snapdragon

Name of the Vulnerable Software and Affected Versions: Qualcomm Snapdragon affected versions not specified Description: The issue is related to an out of bound write in the DSP service due to an improper bound check for the response buffer size. This affects various Qualcomm Snapdragon products,...

CVE-2021-35132: Improper Validation of Specified Quantity in Input

Out of bound write in DSP service due to improper bound check for response buffer size in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables...

PT-2025-25864

Name of the Vulnerable Software and Affected Versions Linux kernel affected versions not specified Description A memory leak issue has been identified in the Linux kernel, specifically in the SMB2 negotiate function. This issue occurs in cases of failure, such as dialect mismatches, where the...

CVE-2019-8922

A heap-based buffer overflow was discovered in bluetoothd in BlueZ through 5.48. There isn't any check on whether there is enough space in the destination buffer. The function simply appends all data passed to it. The values of all attributes that are requested are appended to the output buffer...

Design/Logic Flaw

Possible out of bound access in TA while processing a command from NS side due to improper length check of response buffer in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and...

CVE-2020-11194

Possible out of bound access in TA while processing a command from NS side due to improper length check of response buffer in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and...

The vulnerability of the STUN/TURN response buffer in the Coturn web server allows a attacker to access confidential data.

The vulnerability of the STUN/TURN response buffer in the Coturn web server is related to initialization errors. Exploiting this vulnerability can allow a malicious actor to gain access to confidential data...

Fedora 31 : coturn (2020-9eadf517de)

Coturn 4.5.1.3 ============== - merge PR 575: Fix rpm packaging - merge PR 576: Tell tar to not include the metadata into release - merge PR 574: Change Docker turnserver.conf to latest turnserver.conf - merge PR 566: Remove reference to SSLv3 - merge PR 579: Ignore MD5 for BoringSSL - merge PR...