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BDU FSTEC
BDU FSTEC
added 2022/09/30 12:0 a.m.10 views

The vulnerability of the Audio component in Qualcomm’s embedded software allows a hacker to trigger a service failure or execute arbitrary code.

The vulnerability of the Audio microprogramming component in Qualcomm’s embedded chips is related to a numerical overflow during playback of recordings. Exploiting this vulnerability can allow attackers to cause system failures or execute arbitrary codes...

8.4CVSS7.5AI score0.00119EPSS
SaveExploits0References4
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