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RedhatCVE
RedhatCVE
•added 2026/06/05 7:11 p.m.•30 views

CVE-2026-8676

An attacker is able to downgrade the security of a Bluetooth LE connection by deleting an existing bond, spoofing the bonded device and creating a new bond...

8.8CVSS5.5AI score0.00315EPSS
SaveExploits0References1
Cvelist
Cvelist
•added 2026/05/26 7:36 p.m.•50 views

CVE-2026-8676

An attacker is able to downgrade the security of a Bluetooth LE connection by deleting an existing bond, spoofing the bonded device and creating a new bond...

8.8CVSS0.00315EPSS
SaveExploits0References2
Vulnrichment
Vulnrichment
•added 2026/05/26 7:36 p.m.•14 views

CVE-2026-8676

An attacker is able to downgrade the security of a Bluetooth LE connection by deleting an existing bond, spoofing the bonded device and creating a new bond...

8.8CVSS5.8AI score0.00315EPSS
SaveExploits0References2
CVE
CVE
•added 2026/05/26 7:36 p.m.•50 views

CVE-2026-8676

CVE-2026-8676 describes a vulnerability in Bluetooth Low Energy bonding where an attacker can downgrade security by deleting an existing bond, spoofing the bonded device, and establishing a new bond. The CVSS v3.1 vector indicates an Adjacent attacker, no privileges, low attack complexity, with h...

8.8CVSS5.8AI score0.00315EPSS
SaveExploits0References2
attackerkb
attackerkb
•added 2026/05/26 7:36 p.m.•11 views

CVE-2026-8676

An attacker is able to downgrade the security of a Bluetooth LE connection by deleting an existing bond, spoofing the bonded device and creating a new bond...

8.8CVSS5.8AI score0.00315EPSS
SaveExploits0References3
EUVD
EUVD
•added 2026/05/26 7:36 p.m.•38 views

EUVD-2026-31969

An attacker is able to downgrade the security of a Bluetooth LE connection by deleting an existing bond, spoofing the bonded device and creating a new bond...

8.8CVSS5.8AI score0.00315EPSS
SaveExploits0References2
Positive Technologies
Positive Technologies
•added 2026/05/26 12:00 a.m.•34 views

PT-2026-43409

An attacker is able to downgrade the security of a Bluetooth LE connection by deleting an existing bond, spoofing the bonded device and creating a new bond...

8.8CVSS5.8AI score0.00315EPSS
SaveExploits0References3
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