EUVD-2018-3859

Malware in sbrugna...

CVE-2021-35119

Potential out of Bounds read in FIPS event processing due to improper validation of the length from the firmware in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile...

CVE-2021-35119

Potential out of Bounds read in FIPS event processing due to improper validation of the length from the firmware in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile...

Qualcomm 缓冲区错误漏洞

A Qualcomm chip is a chip from Qualcomm Incorporated USA. A way to miniaturize circuits including primarily semiconductor devices, but also passive components, etc. and is manufactured from time to time on the surface of semiconductor wafers. A buffer error vulnerability exists in multiple Qualco...

Buffer overflow

Lack of buffer length check before copying in WLAN function while processing FIPS event, can lead to a buffer overflow in Snapdragon Mobile in version SD 845...