49 matches found
CVE-2023-43554 Improper Restriction of Operations withing the Bounds of a Memory Buffer in DSP Services
Memory corruption while processing IOCTL handler in FastRPC...
CVE-2023-33078 Buffer Over-read in DSP Services
Information Disclosure while processing IOCTL request in FastRPC...
CVE-2023-33078 Buffer Over-read in DSP Services
Information Disclosure while processing IOCTL request in FastRPC...
CVE-2023-43514 Use After Free in DSP Services
Memory corruption while invoking IOCTLs calls from user space for internal mem MAP and internal mem UNMAP...
CVE-2023-43514 Use After Free in DSP Services
Memory corruption while invoking IOCTLs calls from user space for internal mem MAP and internal mem UNMAP...
CVE-2023-33063
Memory corruption in DSP Services during a remote call from HLOS to DSP...
Memory corruption
Memory corruption in DSP Services during a remote call from HLOS to DSP...
CVE-2023-33063 Use After Free in DSP Services
Memory corruption in DSP Services during a remote call from HLOS to DSP...
CVE-2023-33063
CVE-2023-33063 is a Use-After-Free/memory corruption issue in Qualcomm DSP Services triggered by a remote call from HLOS to DSP. Affected: Qualcomm chipsets with DSP Services; root cause: memory corruption leading to potential unintended behavior. Documents indicate high impact (confidentiality, ...
CVE-2023-33063 Use After Free in DSP Services
Memory corruption in DSP Services during a remote call from HLOS to DSP...
CVE-2023-33063
Memory corruption in DSP Services during a remote call from HLOS to DSP. Recent assessments: Assessed Attacker Value: 0 Assessed Attacker Value: 0Assessed Attacker Value: 0...
VulnCheck KEV: CVE-2023-33063
Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services during a remote call from HLOS to DSP...
Qualcomm Multiple Chipsets Use-After-Free Vulnerability
Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services during a remote call from HLOS to DSP...
CVE-2023-21624
Information disclosure in DSP Services while loading dynamic module...
Information disclosure
Information disclosure in DSP Services while loading dynamic module...
CVE-2023-21624
CVE-2023-21624 is an information-disclosure vulnerability in DSP Services triggered when loading a dynamic module. The issue is documented for Qualcomm components (closed-source) and is referenced in the Android Pixel bulletin as affecting Qualcomm chipsets; affected products include Qualcomm DSP...
CVE-2023-21624 Information Exposure in DSP Services
Information disclosure in DSP Services while loading dynamic module...
CVE-2022-25722
Information exposure in DSP services due to improper handling of freeing memory...