EUVD-2021-17255

Malware in sbrugna...

EUVD-2022-30332

Malicious code in bioql PyPI...

CVE-2022-25677

Memory corruption in diag due to use after free while processing dci packet in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking...

PT-2022-17456 · Qualcomm · Qualcomm Snapdragon

Name of the Vulnerable Software and Affected Versions: Qualcomm Snapdragon affected versions not specified Description: The issue is related to memory corruption in the diag component due to a use-after-free error while processing a DCI packet. This affects various Qualcomm Snapdragon products,...

CVE-2022-25677

CVE-2022-25677 is described as memory corruption in the diag component caused by a use-after-free while processing a DCI packet in Qualcomm Snapdragon platforms (Auto, Compute, Consumer IoT, Industrial IoT, Mobile, Wearables, Wired Infrastructure and Networking). The vulnerability affects Snapdra...

CVE-2021-30324

Possible out of bound write due to lack of boundary check for the maximum size of buffer when sending a DCI packet to remote process in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables,...

Out-of-bounds

Possible out of bound write due to lack of boundary check for the maximum size of buffer when sending a DCI packet to remote process in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables,...

CVE-2021-30324

Possible out of bound write due to lack of boundary check for the maximum size of buffer when sending a DCI packet to remote process in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables,...