CVE-2017-18173

creationtimestamp| type| source ---|---|--- 2019-05-07 02:53:12+00:00| seen| https://t.me/cibsecurity/4136...

CVE-2017-18173

CVE-2017-18173 involves an integer underflow in Snapdragon Mobile when processing an invalid Android verified boot signature with very large length. Affected devices include Qualcomm Snapdragon SoCs such as SD 425, 427, 430, 435, 450, 625, 810, 820, 835, SDM630, SDM636, SDM660 and Snapdragon_High...

CVE-2017-18173

In case of using an invalid android verified boot signature with very large length, an integer underflow occurs in Snapdragon Mobile in SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 810, SD 820, SD 835, SDM630, SDM636, SDM660, SnapdragonHighMed2016...