EUVD-2021-17199

Malware in sbrugna...

EUVD-2024-54921

Malicious code in bioql PyPI...

CVE-2024-13985

A command injection vulnerability in Dahua EIMS versions prior to 2240008 allows unauthenticated remote attackers to execute arbitrary system commands via the capturehandle.action interface. The flaw stems from improper input validation in the captureCommand parameter, which is processed without...

CVE-2021-30268

Possible heap Memory Corruption Issue due to lack of input validation when sending HWTC IQ Capture command in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables...

CVE-2021-42324

An issue was discovered on DCN Digital China Networks S4600-10P-SI devices before R0241.0470. Due to improper parameter validation in the console interface, it is possible for a low-privileged authenticated attacker to escape the sandbox environment and execute system commands as root via shell...

Design/Logic Flaw

An issue was discovered on DCN Digital China Networks S4600-10P-SI devices before R0241.0470. Due to improper parameter validation in the console interface, it is possible for a low-privileged authenticated attacker to escape the sandbox environment and execute system commands as root via shell...

CVE-2021-42324

An issue was discovered on DCN Digital China Networks S4600-10P-SI devices before R0241.0470. Due to improper parameter validation in the console interface, it is possible for a low-privileged authenticated attacker to escape the sandbox environment and execute system commands as root via shell...

CVE-2021-30268

Possible heap Memory Corruption Issue due to lack of input validation when sending HWTC IQ Capture command in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables...

Qualcomm 芯片安全漏洞

A Qualcomm chip is a chip from Qualcomm Incorporated USA. A way to miniaturize circuits mainly semiconductor devices, but also passive components, etc., and are from time to time fabricated on the surface of semiconductor wafers. A security vulnerability exists in Qualcomm Chipsets that stems fro...