CVE-2026-80625

A flaw was found in the Linux kernel's RDMA/hns component. During concurrent driver removal and reset operations, bonding resources are incorrectly released and then re-allocated, leading to a memory leak. This memory leak can potentially cause a kernel panic, resulting in a Denial of Service DoS...

Linux Distros Unpatched Vulnerability : CVE-2026-80625

The Linux/Unix host has one or more packages installed that are impacted by a vulnerability without a vendor supplied patch available. - In the Linux kernel, the following vulnerability has been resolved: RDMA/hns: Fix memory leak of bonding resources In a corner case of concurrent driver removal...

SUSE CVE-2026-80625

In the Linux kernel, the following vulnerability has been resolved: RDMA/hns: Fix memory leak of bonding resources In a corner case of concurrent driver removal and driver reset, bonding resource is first released in hnsrocehwv2exit during driver removal, and then is allocated again in...

CVE-2026-80625

In the Linux kernel, the following vulnerability has been resolved: RDMA/hns: Fix memory leak of bonding resources In a corner case of concurrent driver removal and driver reset, bonding resource is first released in hnsrocehwv2exit during driver removal, and then is allocated again in...

UBUNTU-CVE-2026-80625

In the Linux kernel, the following vulnerability has been resolved: RDMA/hns: Fix memory leak of bonding resources In a corner case of concurrent driver removal and driver reset, bonding resource is first released in hnsrocehwv2exit during driver removal, and then is allocated again in...

CVE-2026-80625

In the Linux kernel, the following vulnerability has been resolved: RDMA/hns: Fix memory leak of bonding resources In a corner case of concurrent driver removal and driver reset, bonding resource is first released in hnsrocehwv2exit during driver removal, and then is allocated again in...

CVE-2026-80625

In the Linux kernel, the following vulnerability has been resolved: RDMA/hns: Fix memory leak of bonding resources In a corner case of concurrent driver removal and driver reset, bonding resource is first released in hnsrocehwv2exit during driver removal, and then is allocated again in...

CVE-2026-80625 RDMA/hns: Fix memory leak of bonding resources

In the Linux kernel, the following vulnerability has been resolved: RDMA/hns: Fix memory leak of bonding resources In a corner case of concurrent driver removal and driver reset, bonding resource is first released in hnsrocehwv2exit during driver removal, and then is allocated again in...

EUVD-2026-67501

In the Linux kernel, the following vulnerability has been resolved: RDMA/hns: Fix memory leak of bonding resources In a corner case of concurrent driver removal and driver reset, bonding resource is first released in hnsrocehwv2exit during driver removal, and then is allocated again in...

CVE-2026-80625

CVE-2026-80625 affects the Linux kernel in the RDMA/hns driver. In a corner case of concurrent driver removal and driver reset , a bonding resource is first released in hns_roce_hw_v2_exit() and then re-allocated in hns_roce_register_device(), but the release timing has already passed. This cause...

CVE-2026-80625 RDMA/hns: Fix memory leak of bonding resources

In the Linux kernel, the following vulnerability has been resolved: RDMA/hns: Fix memory leak of bonding resources In a corner case of concurrent driver removal and driver reset, bonding resource is first released in hnsrocehwv2exit during driver removal, and then is allocated again in...

CVE-2026-80625: Undefined Security Weakness

In the Linux kernel, the following vulnerability has been resolved: RDMA/hns: Fix memory leak of bonding resources In a corner case of concurrent driver removal and driver reset, bonding resource is first released in hnsrocehwv2exit during driver removal, and then is allocated again in...

PT-2026-82925

Name of the Vulnerable Software and Affected Versions Linux kernel affected versions not specified Description A memory leak occurs in the RDMA/hns component during a specific scenario involving concurrent driver removal and driver reset. The bonding resource is released in the hns roce hw v2 exi...