CVE-2020-11183

CVE-2020-11183 describes a potential buffer overflow in the Snapdragon platform's display service, enabling local privilege escalation by executing code as the affected service. The vulnerability affects multiple Snapdragon families (Auto, Connectivity, Consumer IoT, Industrial IoT, Mobile, Voice...

CVE-2020-11167

CVE-2020-11167 is a Qualcomm Snapdragon Bluetooth issue where memory corruption can occur in the L2CAP reassembly logic if a remote device sends more data than expected. Connected sources (Qualcomm December 2020 bulletins, Red Hat advisory, NVD entry) confirm affected Snapdragon Bluetooth compone...

CVE-2020-11152

CVE-2020-11152 describes a race condition in the HAL layer when processing callback objects from HIDL across Qualcomm Snapdragon Auto/Compute/Consumer IoT/Industrial IoT/Mobile/Wearables families. Root cause is lack of synchronization when accessing objects, enabling a potential impact on confide...

CVE-2020-11167

Memory corruption while calculating L2CAP packet length in reassembly logic when remote sends more data than expected in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearab...

CVE-2020-11151

Race condition occurs while calling user space ioctl from two different threads can results to use after free issue in video in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables...

CVE-2020-11151

CVE-2020-11151 describes a race condition in video handling on Qualcomm Snapdragon devices (Auto, Compute, Connectivity, Industrial IOT, Mobile, Wearables). Two threads calling a user-space ioctl concurrently can trigger a use-after-free in the video stack. Impact per NVD indicates potential high...

CVE-2020-11149

CVE-2020-11149 involves an out-of-bounds access caused by an out-of-range pointer offset in the camera driver across Snapdragon platforms (Auto/Compute/Connectivity/Consumer IoT/Industrial IoT/Mobile/Voice & Music/Wearables). The vulnerability stems from improper pointer handling in the camera su...

CVE-2020-11150

CVE-2020-11150 describes an out-of-bounds memory access in the camera driver caused by improper validation of data from UMD, which affects pointer offset manipulation across multiple Snapdragon SKUs (Auto/Compute/Connectivity/Consumer IoT/Industrial IoT/Mobile/Voice & Music/Wearables). The issue ...

CVE-2020-11148

CVE-2020-11148 describes a use-after-free in HIDL when posting events from a callback in a Snapdragon stack (Auto/Compute/Connectivity/Consumer IOT/Industrial IOT/Mobile/Wearables). The root cause is that a callback instance can be deleted in a window where an internal mutex is not held and a clo...

CVE-2020-11148

Use after free issue in HIDL while using callback to post event in Rx thread when internal mutex is not acquired and meantime close is triggered and callback instance is deleted in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT,...

CVE-2020-11146

Out of bound write while copying data using IOCTL due to lack of check of array index received from user in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables...

CVE-2020-11146

CVE-2020-11146 describes an out-of-bounds write during IOCTL data copying due to missing check of a user-provided array index in Qualcomm Snapdragon components (across Snapdragon Auto, Compute, Connectivity, Consumer IOT, Industrial IOT, Mobile, Voice & Music, Wearables). This enables a local att...

CVE-2020-11145

CVE-2020-11145 describes a divide-by-zero flaw in the delta extension header update caused by improper validation of master SN and extension header SN in Qualcomm Snapdragon components (Auto, Compute, Connectivity, Consumer IoT, Industrial IoT, IoT, Mobile, Wearables, etc.). This is reported acro...

CVE-2020-11144

CVE-2020-11144 affects Qualcomm Snapdragon family components (Snapdragon Auto, Compute, Connectivity, Consumer IOT, Industrial IOT, IoT, Mobile, Voice & Music, Wearables). Root cause: buffer over-read from decompression of invalid DL ROHC packets due to missing size check on the compressed packet...

CVE-2020-11140

CVE-2020-11140 describes an out-of-bounds memory access during music playback with ALAC-modified content due to improper validation in Qualcomm Snapdragon components. Affected are Snapdragon Auto, Compute, Connectivity, Consumer IOT, Industrial IOT, IoT, Mobile, Voice & Music, Wearables, and Wire...

CVE-2020-11143

Out of bound memory access during music playback with modified content due to copying data without checking destination buffer size in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon...

CVE-2020-11139

CVE-2020-11139 describes an out-of-bounds memory access when processing frames due to insufficient validation of invalid frames in Qualcomm Snapdragon components (across Snapdragon Auto/Compute/Connectivity/IoT families). The vulnerability affects Snapdragon platforms and is associated with proce...

CVE-2020-11136

CVE-2020-11136 corresponds to a buffer over-read in the Qualcomm audio driver caused by not returning NULL for a zero-sized memory request in the vulnerable Snapdragon family (Auto/Compute/Connectivity/IOT/Mobile, etc.). The issue affects Qualcomm closed‑source components and is listed as Critica...

Multiple Qualcomm Products Input Validation Error Vulnerability

A Qualcomm chip is a chip from Qualcomm Incorporated USA. a way to miniaturize circuitry including primarily semiconductor devices, but also passive components, etc. and is manufactured from time to time on the surface of semiconductor wafers. An input validation error vulnerability exists in...

Buffer Error Vulnerability in Multiple Qualcomm Products

A Qualcomm chip is a chip from Qualcomm Incorporated USA. a way of miniaturizing circuits mainly semiconductor devices, but also passive components, etc. and is manufactured from time to time on the surface of semiconductor wafers. A buffer error vulnerability exists in multiple Qualcomm products...