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CVE
CVE
•added 2026/08/16 5:27 a.m.•53 views

CVE-2026-17581

The CVE concerns the WCPOS – Point of Sale (POS) plugin for WooCommerce (WordPress). Affected versions: up to 1.9.14. Root cause: the Receipt_Renderer_Factory dispatches templates using the thermal engine to the Legacy_Php_Renderer instead of a safe thermal-specific renderer, enabling Code Inject...

7.2CVSS6.3AI score0.0137EPSS
SaveExploits0References12
EUVD
EUVD
•added 2025/10/07 12:30 a.m.•21 views

EUVD-2017-9292

Malware in sbrugna...

7.8CVSS7.7AI score0.00243EPSS
SaveExploits0References2
Prion
Prion
•added 2019/05/06 11:29 p.m.•33 views

Race condition

A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20...

7.2CVSS7.8AI score0.00243EPSS
SaveExploits0References1
NVD
NVD
•added 2019/05/06 11:29 p.m.•27 views

CVE-2017-18157

A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20...

7.8CVSS7.8AI score0.00243EPSS
SaveExploits0References1
CVE
CVE
•added 2019/05/06 10:31 p.m.•68 views

CVE-2017-18157

CVE-2017-18157 is described as a Use After Free condition in the Thermal Engine affecting Snapdragon Automotive, Mobile, and Wear platforms (list includes MDM9206, MDM9607, MDM9650, MSM89xx series, SD 210–835, SDX20, etc.). The connected sources corroborate the presence of a use-after-free in the...

7.8CVSS7.7AI score0.00243EPSS
SaveExploits0References1Affected Software1
Cvelist
Cvelist
•added 2019/05/06 10:31 p.m.•39 views

CVE-2017-18157

A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20...

7.8AI score0.00243EPSS
SaveExploits0References1
Rapid7 Vulnerability Database (full)
Rapid7 Vulnerability Database (full)
•added 2019/05/06 12:00 a.m.•4 views

CVE-2017-18157: Use After Free

A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20...

7.8CVSS5.7AI score0.00243EPSS
SaveExploits0References2
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