CVE-2017-18275

A new account can be inserted into simContacts service using Android command line tool in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 820, SD 820A, S...

CVE-2017-18275

CVE-2017-18275 is a local, command-injection style vulnerability affecting the simContacts service on Snapdragon-based devices (Automobile, Mobile, Wear) across numerous SD/SoC revisions. Exploitation would enable a new account insertion via the Android command line, with attack vector LOCAL, low...

CVE-2017-18274

The CVE-2017-18274 entry describes a buffer overflow in Qualcomm Snapdragon components (Snapdragon Automobile, Mobile, Wear across listed SDMs and processors) caused by iterating through models in a fixed‑size actData array while the reported count is greater than the array size. This is a local ...

CVE-2017-18274

While iterating through the models contained in a fixed-size array in the actData structure, which also stores an incorrect number of models that is greater than the size of the array, a buffer overflow occurs in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607,...

CVE-2017-18173

CVE-2017-18173 involves an integer underflow in Snapdragon Mobile when processing an invalid Android verified boot signature with very large length. Affected devices include Qualcomm Snapdragon SoCs such as SD 425, 427, 430, 435, 450, 625, 810, 820, 835, SDM630, SDM636, SDM660 and Snapdragon_High...

CVE-2017-18173

In case of using an invalid android verified boot signature with very large length, an integer underflow occurs in Snapdragon Mobile in SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 810, SD 820, SD 835, SDM630, SDM636, SDM660, SnapdragonHighMed2016...

CVE-2017-18157

A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20...

CVE-2017-18157

CVE-2017-18157 is described as a Use After Free condition in the Thermal Engine affecting Snapdragon Automotive, Mobile, and Wear platforms (list includes MDM9206, MDM9607, MDM9650, MSM89xx series, SD 210–835, SDX20, etc.). The connected sources corroborate the presence of a use-after-free in the...

CVE-2017-18156

While processing camera buffers in camera driver, a use after free condition can occur in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8996AU, SD 210/SD 212/SD 205, SD 625, SD 820, SD 820A, SD 835, SDX20...

CVE-2017-18156

CVE-2017-18156 describes a use-after-free condition in the camera driver when processing camera buffers, affecting Qualcomm Snapdragon-based devices (including Snapdragon Automobile, Mobile, and Wear across listed silicon families). The issue is triggered locally through the camera subsystem, wit...

CVE-2017-15841

When HOST sends a Special command ID packet, Controller triggers a RAM Dump and FW reset in Snapdragon Mobile in version SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 835, SnapdragonHighMed2016...

CVE-2017-15841

CVE-2017-15841 affects Snapdragon Mobile on multiple SoCs (SD 410/12, 425, 427, 430, 435, 450, 615/16/SD 415, 625, 650/52, 820, 835, Snapdragon_High_Med_2016). The issue occurs when HOST sends a Special command ID packet, causing the Controller to trigger a RAM dump and a FW reset. Documented imp...

CVE-2017-18131

In QTEE, an incorrect fuse value can be blown in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 820, SD 820A, SD 835, SD 845, SDM429, SDM439,...

CVE-2017-18131

In CVE-2017-18131, the issue is in QTEE where an incorrect fuse value can be blown on Qualcomm Snapdragon platforms (list of Snapdragon Automotive/Mobile/Wear variants and chipsets). The connected sources (NVD/NVD listing and CVE records) specify the affected families and device suffixes, with ro...

CVE-2019-2256

An unprivileged user can craft a bitstream such that the payload encoded in the bitstream gains code execution in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in...

CVE-2018-5912

Potential buffer overflow in Video due to lack of input validation in input and output values in Snapdragon Automobile, Snapdragon Mobile in MSM8996AU, SD 450, SD 625, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660...

CVE-2018-13898

Out-of-Bounds write due to incorrect array index check in PMIC in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music in MDM9150, MDM9206, MDM9607, MDM9650, MDM9655,...

CVE-2019-2255

An unprivileged user can craft a bitstream such that the payload encoded in the bitstream gains code execution in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in...

Qualcomm Critical Flaw Exposes Private Keys For Android Devices

Researchers have uncovered a side-channel attack that enables a bad actor to extract sensitive data from Qualcomm’s secure keystore. The critical flaw impacts most modern Android devices that use Qualcomm chips. The issue stems from an issue in Qualcomm technology, dubbed the Qualcomm Secure...

Buffer overflow

kernel could return a received message length higher than expected, which leads to buffer overflow in a subsequent operation and stops normal operation in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables, in MDM9150, MDM9206, MDM9607,...