Design/Logic Flaw

Use after free in QSH client rule processing in snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 636, SD 820, SD 835, SDA660, SDM630, SDM660,...

CVE-2017-18323

Cryptographic key material leaked in TDSCDMA RRC debug messages in snapdragon automobile, snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9615, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 430, SD 450, SD...

CVE-2017-18322

Cryptographic key material leaked in WCDMA debug messages in snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD...

CVE-2017-11004

A non-secure user may be able to access certain registers in snapdragon automobile, snapdragon mobile and snapdragon wear in versions IPQ8074, MDM9206, MDM9607, MDM9635M, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD...

CVE-2017-18323

Cryptographic key material leaked in TDSCDMA RRC debug messages in snapdragon automobile, snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9615, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 430, SD 450, SD...

CVE-2017-18330

Buffer overflow in AES-CCM and AES-GCM encryption via initialization vector in snapdragon automobile, snapdragon mobile and snapdragon wear in versions IPQ8074, MDM9206, MDM9607, MDM9635M, MDM9640, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD...

CVE-2017-18327

CVE-2017-18327 concerns logging of security keys when any WCDMA call is configured or reconfigured on Qualcomm Snapdragon platforms (automotive, mobile, wear) across listed chipsets and SoCs (e.g., MDM9607, MSM8996AU, SD 210/212/205, SD 820/835/845, SDA660, etc.). The NVD entry lists affected pro...

CVE-2017-18321

CVE-2017-18321 affects Snapdragon mobile devices (examples listed: MDM9650, MDM9655, SD 835, SDA660). The issue involves leakage of security keys used by the terminal and NW for a session, constituting an information-disclosure risk. Root cause details are not provided beyond the key leakage desc...

CVE-2017-18141

When a 3rd party TEE has been loaded it is possible for the non-secure world to create a secure monitor call which will give it access to privileged functions meant to only be accessible from the TEE in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear in versions IPQ8074, MDM9206,...

CVE-2017-18319

CVE-2017-18319 corresponds to an information disclosure in the UIM API debug messages affecting Snapdragon/mobile devices listed (MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/212/205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415,...

CVE-2017-18328

Use after free in QSH client rule processing in snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 636, SD 820, SD 835, SDA660, SDM630, SDM660,...

CVE-2017-18321

Security keys used by the terminal and NW for a session could be leaked in snapdragon mobile in versions MDM9650, MDM9655, SD 835, SDA660...

CVE-2017-18320

CVE-2017-18320 describes a data abort in QSEE when unloading on a third-party TEE without prior loading, affecting Qualcomm Snapdragon automotive/mobile platforms across numerous SoCs (e.g., MSM8996AU, SD 410/12, 820, 835, 650/52, 710/670, 810, 820A, 835, 660, several SDM/SXR variants). The linke...

CVE-2017-18328

CVE-2017-18328 describes a use-after-free in the QSH client rule processing on Qualcomm Snapdragon mobile/wear platforms (MDM/SDM/SoC families listed). Documented impact is high local vulnerability with potential for complete confidentiality, integrity, and availability compromise if exploited. N...

CVE-2017-18329

Possible Buffer overflow when transmitting an RTP packet in snapdragon automobile and snapdragon wear in versions MDM9615, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 636, SD...

CVE-2017-18326

Cryptographic keys are printed in modem debug messages in snapdragon mobile and snapdragon wear in versions MDM9607, MDM9615, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 636,...

CVE-2017-18324

Cryptographic key material leakage in debug messages affecting GERAN on Snapdragon mobile/wear (various MDM/SD/SM/SDX devices). Root cause: leakage of keys in debug output for affected Qualcomm components; CVE-2017-18324. Consequences: information disclosure with partial confidentiality impact as...

CVE-2017-11004

A non-secure user may be able to access certain registers in snapdragon automobile, snapdragon mobile and snapdragon wear in versions IPQ8074, MDM9206, MDM9607, MDM9635M, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD...

CVE-2017-18329

CVE-2017-18329 describes a potential buffer overflow in RTP packet handling on Qualcomm Snapdragon automotive and wearable platforms. Affected are Snapdragon Automotive/Wear devices across listed Snapdragon/HW variants (e.g., MDM9615/9625/9635M/9640/9645/9650/9655, MSM8909W, MSM8996AU, SD 210–SD ...

Unspecified Vulnerability in ASUS ZenFone 3 Max (CNVD-2020-22296)

ASUS ZenFone 3 Max is an Android-based smartphone from ASUS. Pre-installation in ASUS ZenFone 3 Max Build fingerprint used is asus/USPhone/ASUSX0081:7.0/NRD90M/USPhone-14.14.1711.92-20171208:user/release-keys A security vulnerability exists in the com.asus.loguploader.LogUploaderService component...