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CNNVD
CNNVD
•added 2021/11/01 12:00 a.m.•16 views

Qualcomm 芯片输入验证错误漏洞

A Qualcomm chip is a chip from Qualcomm Incorporated USA. A way to miniaturize circuits mainly semiconductor devices, but also passive components, etc. and are often manufactured on the surface of semiconductor wafers. An input validation error vulnerability exists in Qualcomm chips affecting the...

8.4CVSS7.3AI score0.00154EPSS
SaveExploits0References4
Prion
Prion
•added 2020/11/12 10:15 a.m.•36 views

Input validation

Out of Bound issue in DSP services while processing received arguments due to improper validation of length received as an argument' in SD820, SD821, SD820, QCS603, QCS605, SDA855, SA6155P, SA6145P, SA6155, SA6155P, SD855, SD 675, SD660, SD429, SD439...

7.2CVSS7.6AI score0.01725EPSS
SaveExploits1References3
Prion
Prion
•added 2020/11/12 10:15 a.m.•37 views

Authorization

Improper authorization in DSP process could allow unauthorized users to downgrade the library versions in SD820, SD821, SD820, QCS603, QCS605, SDA855, SA6155P, SA6145P, SA6155, SA6155P, SD855, SD 675, SD660, SD429, SD439...

2.1CVSS5.5AI score0.01568EPSS
SaveExploits1References3
CVE
CVE
•added 2020/11/12 10:00 a.m.•87 views

CVE-2020-11209

CVE-2020-11209 concerns Qualcomm’s DSP/Hexagon components (Snapdragon) where improper authorization in the DSP process could allow unauthorized downgrade of library versions across multiple Snapdragon platforms (SD820/821/855/675/660/429/439, SD855, SD860 etc., including QCS603/605, SDA855, SA615...

5.5CVSS5.5AI score0.01568EPSS
SaveExploits1References3Affected Software1
Cvelist
Cvelist
•added 2020/11/12 10:00 a.m.•45 views

CVE-2020-11208

Out of Bound issue in DSP services while processing received arguments due to improper validation of length received as an argument' in SD820, SD821, SD820, QCS603, QCS605, SDA855, SA6155P, SA6145P, SA6155, SA6155P, SD855, SD 675, SD660, SD429, SD439...

7.7AI score0.01725EPSS
SaveExploits1References3
Rapid7 Vulnerability Database (full)
Rapid7 Vulnerability Database (full)
•added 2020/11/12 12:00 a.m.•2 views

CVE-2020-11209: Incorrect Authorization

Improper authorization in DSP process could allow unauthorized users to downgrade the library versions in SD820, SD821, SD820, QCS603, QCS605, SDA855, SA6155P, SA6145P, SA6155, SA6155P, SD855, SD 675, SD660, SD429, SD439...

5.5CVSS5.8AI score0.01568EPSS
SaveExploits1References2
Rapid7 Vulnerability Database (full)
Rapid7 Vulnerability Database (full)
•added 2020/11/12 12:00 a.m.•1 views

CVE-2020-11208: Integer Underflow (Wrap or Wraparound)

Out of Bound issue in DSP services while processing received arguments due to improper validation of length received as an argument' in SD820, SD821, SD820, QCS603, QCS605, SDA855, SA6155P, SA6145P, SA6155, SA6155P, SD855, SD 675, SD660, SD429, SD439...

7.8CVSS5.8AI score0.01725EPSS
SaveExploits1References2
Rapid7 Vulnerability Database (full)
Rapid7 Vulnerability Database (full)
•added 2019/11/06 12:00 a.m.•2 views

CVE-2019-10533: Improper Validation of Array Index

Out of bound access due to improper validation of array index cause the index table entry to get corrupt in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in MDM9206, MDM9607, MSM8909W,...

10CVSS8.2AI score0.00907EPSS
SaveExploits0References2
Rapid7 Vulnerability Database (full)
Rapid7 Vulnerability Database (full)
•added 2019/07/25 12:00 a.m.•3 views

CVE-2019-2301: Out-of-bounds Read

Possibility of out-of-bound read if id received from SPI is not in range of FIFO in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking in IPQ4019, IPQ8064, MSM8909W,...

7.8CVSS5.7AI score0.00198EPSS
SaveExploits0References2
Rapid7 Vulnerability Database (full)
Rapid7 Vulnerability Database (full)
•added 2019/07/22 12:00 a.m.•2 views

CVE-2019-2260: Concurrent Execution using Shared Resource with Improper Synchronization

A race condition occurs while processing perf-event which can lead to a use after free condition in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in MDM9150, MDM9206, MDM9607, MDM9640,...

7CVSS8.3AI score0.0014EPSS
SaveExploits0References3
Rapid7 Vulnerability Database (full)
Rapid7 Vulnerability Database (full)
•added 2019/05/24 12:00 a.m.•2 views

CVE-2018-13899: Use After Free

Processing messages after error may result in user after free memory fault in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables in MDM9150, MDM9206, MDM9607, MDM9650, MSM8909W, QCS605, Qualcomm...

7.8CVSS6AI score0.00211EPSS
SaveExploits0References2
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