Lucene search
+L

3 matches found

BDU FSTEC
BDU FSTEC
•added 2025/10/01 12:00 a.m.•20 views

Qualcomm Embedded Software Buffer Overflow DoS

The vulnerability of microprogramming software in embedded Qualcomm chips relates to the copying of buffers without checking the size of input data when processing certain files in the Powerline Communication firmware. Exploiting this vulnerability can allow a remote attacker to damage memory...

7.5CVSS5.8AI score0.00181EPSS
SaveExploits0References2
BDU FSTEC
BDU FSTEC
•added 2025/08/26 12:00 a.m.•20 views

PIB files Qualcomm unauthorized access

The vulnerability of PIB files in microprogramming software for embedded Qualcomm chips relates to the disclosure of confidential information through metadata in the Powerline Communication firmware. Exploiting this vulnerability can allow an unauthorized actor to gain unauthorized access to...

7.8CVSS5.8AI score0.00186EPSS
SaveExploits0References3
Positive Technologies
Positive Technologies
•added 2023/01/05 12:00 a.m.•42 views

PT-2023-1617 · Qualcomm · Qualcomm Embedded Platform

Name of the Vulnerable Software and Affected Versions: Powerline Communication Firmware affected versions not specified Qualcomm embedded platform software affected versions not specified Description: The issue is related to memory corruption due to information exposure in Powerline Communication...

9.8CVSS7.2AI score0.0037EPSS
SaveExploits0References8
Rows per page
Query Builder