CVE-2022-40507

CVE-2022-40507 describes memory corruption due to a double free in Core when mapping an HLOS address to the list, affecting Qualcomm closed‑source components. The issue has local attack vector with low privileges and no user interaction, with confidentiality, integrity, and availability impacts m...

CVE-2022-40507 Double free in Core

Memory corruption due to double free in Core while mapping HLOS address to the list...

CVE-2022-33307 Double free in Automotive

Memory Corruption due to double free in automotive when a bad HLOS address for one of the lists to be mapped is passed...

CVE-2022-33307 Double free in Automotive

Memory Corruption due to double free in automotive when a bad HLOS address for one of the lists to be mapped is passed...

CVE-2022-33307

CVE-2022-33307 describes a memory corruption vulnerability caused by a double-free in automotive software when a bad HLOS address is passed while mapping one of the lists. The issue is rooted in improper memory handling inside the affected automotive component (lists to be mapped) and is supporte...

CVE-2022-33307: Double Free

Memory Corruption due to double free in automotive when a bad HLOS address for one of the lists to be mapped is passed...

CVE-2022-33278

Memory corruption due to buffer copy without checking the size of input in HLOS when input message size is larger than the buffer capacity...

CVE-2022-33278 Buffer copy without checking the size of input in HLOS

Memory corruption due to buffer copy without checking the size of input in HLOS when input message size is larger than the buffer capacity...

CVE-2022-33278

CVE-2022-33278: Memory corruption due to a buffer copy without input size checking in HLOS when the input message exceeds the buffer capacity. Documented as a Qualcomm closed‑source component issue with a CVSS v3.1 base score of 7.8 (HIGH), attack vector LOCAL, low attack complexity, privileges r...

CVE-2022-33278: Buffer Copy without Checking Size of Input

Memory corruption due to buffer copy without checking the size of input in HLOS when input message size is larger than the buffer capacity...

CVE-2021-35094

Improper verification of timeout-based authentication in identity credential can lead to invalid authorization in HLOS in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile...

CVE-2021-35094

Improper verification of timeout-based authentication in identity credential can lead to invalid authorization in HLOS in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile...

CVE-2021-35094

CVE-2021-35094 involves Qualcomm components (e.g., QCA family, AQT1000) with an improper validation of timeout-based authentication in identity credentials, which can lead to invalid authorization in HLOS. The issue affects multiple Qualcomm/Qualcomm-supplied platforms including Snapdragon Auto, ...

PT-2022-6727 · Qualcomm +1 · Qualcomm Embedded Platform +1

Name of the Vulnerable Software and Affected Versions: Android versions affected versions not specified Qualcomm embedded platform versions affected versions not specified Description: The issue is related to a memory corruption problem in the GPS HLOS driver of Android operating systems on...

CVE-2021-30261

Possible integer and heap overflow due to lack of input command size validation while handling beacon template update command from HLOS in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables...

Integer overflow

Possible integer and heap overflow due to lack of input command size validation while handling beacon template update command from HLOS in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables...

CVE-2021-30261

Possible integer and heap overflow due to lack of input command size validation while handling beacon template update command from HLOS in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables...

Qualcomm 芯片缓冲区错误漏洞

A Qualcomm chip is a chip from Qualcomm Incorporated USA. A way to miniaturize circuits mainly semiconductor devices, but also passive components, etc., and from time to time are manufactured on the surface of semiconductor wafers. A buffer error vulnerability exists in Qualcomm chips that stems...

多款Qualcomm芯片缓冲区错误漏洞

A Qualcomm chip is a chip from Qualcomm Incorporated USA. A way to miniaturize circuits mainly semiconductor devices, but also passive components, etc., and from time to time fabricated on the surface of semiconductor wafers. The Qualcomm chip suffers from a buffer error vulnerability that stems...

Qualcomm 芯片输入验证错误漏洞

Qualcomm MSM8996AU and others are products of Qualcomm Incorporated Qualcomm, U.S.A. The MSM8996AU is a central processing unit CPU product.QCA6574AU is a central processing unit CPU product.SD 636 is a central processing unit CPU product. A vulnerability exists in a number of qualcomm products d...