CVE-2019-19196

The CVE-2019-19196 entry relates to Telink Semiconductor’s BLE SDK SMP implementation. Affected SDKs (before Nov 2019) include TLSR8x5x (up to v3.4.0), TLSR823x (up to v1.3.0), and TLSR826x (up to v3.3). The vulnerability arises when a pairing request with a key size greater than 16 bytes is acce...

CVE-2019-19196

The Bluetooth Low Energy Secure Manager Protocol SMP implementation on Telink Semiconductor BLE SDK versions before November 2019 for TLSR8x5x through 3.4.0, TLSR823x through 1.3.0, and TLSR826x through 3.3 devices accepts a pairing request with a key size greater than 16 bytes, allowing an...

CVE-2019-19196

The Bluetooth Low Energy Secure Manager Protocol SMP implementation on Telink Semiconductor BLE SDK versions before November 2019 for TLSR8x5x through 3.4.0, TLSR823x through 1.3.0, and TLSR826x through 3.3 devices accepts a pairing request with a key size greater than 16 bytes, allowing an...

CVE-2019-16336

The Bluetooth Low Energy implementation in Cypress PSoC 4 BLE component 3.61 and earlier processes data channel frames with a payload length larger than the configured link layer maximum RX payload size, which allows attackers in radio range to cause a denial of service crash via a crafted BLE Li...

CVE-2019-19194

The Bluetooth Low Energy Secure Manager Protocol SMP implementation on Telink Semiconductor BLE SDK versions before November 2019 for TLSR8x5x through 3.4.0, TLSR823x through 1.3.0, and TLSR826x through 3.3 devices installs a zero long term key LTK if an out-of-order link-layer encryption request...

CVE-2019-17519

The Bluetooth Low Energy implementation on NXP SDK through 2.2.1 for KW41Z devices does not properly restrict the Link Layer payload length, allowing attackers in radio range to cause a buffer overflow via a crafted packet. Recent assessments: pbarry25 at April 19, 2020 2:45am UTC reported: This...

Microchip Technology BluSDK Smart Denial of Service Vulnerability

Microchip Technology BluSDK Smart is an SDK package developed by Microchip Technology to implement Bluetooth. A security vulnerability exists in the Bluetooth Low Energy implementation in Microchip Technology BluSDK Smart 6.2 and prior versions for ATSAMB11, which arises from the program's failur...

CVE-2019-19195

The Bluetooth Low Energy implementation on Microchip Technology BluSDK Smart through 6.2 for ATSAMB11 devices does not properly restrict link-layer data length on reception, allowing attackers in radio range to cause a denial of service crash via a crafted packet...

CVE-2019-19193

The Bluetooth Low Energy peripheral implementation on Texas Instruments SIMPLELINK-CC2640R2-SDK through 3.30.00.20 and BLE-STACK through 1.5.0 before Q4 2019 for CC2640R2 and CC2540/1 devices does not properly restrict the advertisement connection request packet on reception, allowing attackers i...

CVE-2019-19195

The Bluetooth Low Energy implementation on Microchip Technology BluSDK Smart through 6.2 for ATSAMB11 devices does not properly restrict link-layer data length on reception, allowing attackers in radio range to cause a denial of service crash via a crafted packet...

CVE-2019-19193

The Bluetooth Low Energy peripheral implementation on Texas Instruments SIMPLELINK-CC2640R2-SDK through 3.30.00.20 and BLE-STACK through 1.5.0 before Q4 2019 for CC2640R2 and CC2540/1 devices does not properly restrict the advertisement connection request packet on reception, allowing attackers i...

CVE-2019-17520

The Bluetooth Low Energy implementation on Texas Instruments SDK through 3.30.00.20 for CC2640R2 devices does not properly restrict the SM Public Key packet on reception, allowing attackers in radio range to cause a denial of service crash via crafted packets...

CVE-2019-17520

The Bluetooth Low Energy implementation on Texas Instruments SDK through 3.30.00.20 for CC2640R2 devices does not properly restrict the SM Public Key packet on reception, allowing attackers in radio range to cause a denial of service crash via crafted packets...

CVE-2019-17517

The Bluetooth Low Energy implementation on Dialog Semiconductor SDK through 5.0.4 for DA14580/1/2/3 devices does not properly restrict the L2CAP payload length, allowing attackers in radio range to cause a buffer overflow via a crafted Link Layer packet...

CVE-2019-17517

The Bluetooth Low Energy implementation on Dialog Semiconductor SDK through 5.0.4 for DA14580/1/2/3 devices does not properly restrict the L2CAP payload length, allowing attackers in radio range to cause a buffer overflow via a crafted Link Layer packet...

CVE-2019-17518

The Bluetooth Low Energy implementation on Dialog Semiconductor SDK through 1.0.14.1081 for DA1468x devices responds to link layer packets with a payload length larger than expected, allowing attackers in radio range to cause a buffer overflow via a crafted packet. This affects, for example, Augu...

CVE-2019-17060

The Bluetooth Low Energy BLE stack implementation on the NXP KW41Z based on the MCUXpresso SDK with Bluetooth Low Energy Driver 2.2.1 and earlier does not properly restrict the BLE Link Layer header and executes certain memory contents upon receiving a packet with a Link Layer ID LLID equal to...

CVE-2019-17061

The Bluetooth Low Energy BLE stack implementation on Cypress PSoC 4 through 3.62 devices does not properly restrict the BLE Link Layer header and executes certain memory contents upon receiving a packet with a Link Layer ID LLID equal to zero. This allows attackers within radio range to cause...

Buffer overflow

The Bluetooth Low Energy implementation on Dialog Semiconductor SDK through 5.0.4 for DA14580/1/2/3 devices does not properly restrict the L2CAP payload length, allowing attackers in radio range to cause a buffer overflow via a crafted Link Layer packet...

Code injection

The Bluetooth Low Energy implementation on Texas Instruments SDK through 3.30.00.20 for CC2640R2 devices does not properly restrict the SM Public Key packet on reception, allowing attackers in radio range to cause a denial of service crash via crafted packets...