CVE-2024-33060 Use After Free in DSP Service

Memory corruption when two threads try to map and unmap a single node simultaneously...

CVE-2024-33060 Use After Free in DSP Service

Memory corruption when two threads try to map and unmap a single node simultaneously...

Memory corruption

Memory corruption in DSP Service during a remote call from HLOS to DSP...

CVE-2023-33029 Use After Free in DSP Service

Memory corruption in DSP Service during a remote call from HLOS to DSP...

CVE-2023-33029

CVE-2023-33029 involves a memory corruption issue in the Qualcomm DSP Service when a remote call is made from HLOS to DSP. Reports consistently describe it as a DSP Service memory corruption vulnerability; CVSS metrics indicate local attack vector, low privileges, no user interaction, and high im...

CVE-2023-33029 Use After Free in DSP Service

Memory corruption in DSP Service during a remote call from HLOS to DSP...

Qualcomm Chip Resource Management Error Vulnerability

A Qualcomm chip is a chip from Qualcomm Incorporated USA. A way to miniaturize circuits mainly semiconductor devices, but also passive components, etc. and are often manufactured on the surface of semiconductor wafers. A resource management error vulnerability exists in the Qualcomm chip that ste...

CVE-2021-35132

Out of bound write in DSP service due to improper bound check for response buffer size in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables...

Input validation

Out of bound write in DSP service due to improper bound check for response buffer size in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables...

CVE-2021-35132

Out of bound write in DSP service due to improper bound check for response buffer size in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables...

CVE-2021-35132

CVE-2021-35132 describes an out-of-bounds write in Qualcomm Snapdragon DSP service (closed-source components) caused by an improper bound check on the response buffer. Affected are multiple Snapdragon line items (Auto, Compute, Connectivity, Consumer IOT, Industrial IOT, Mobile, Wearables). The i...

Qualcomm 芯片缓冲区错误漏洞

A Qualcomm chip is a chip from Qualcomm Incorporated USA. A way of miniaturizing circuits mainly semiconductor devices, but also passive components, etc., and from time to time manufactured on the surface of semiconductor wafers. The Qualcomm chip has a security vulnerability that results from a...

CVE-2021-35126

Memory corruption in DSP service due to improper validation of input parameters in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile...

Input validation

Memory corruption in DSP service due to improper validation of input parameters in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile...

CVE-2021-35126

Memory corruption in DSP service due to improper validation of input parameters in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile...

CVE-2021-35126

The CVE-2021-35126 entry describes a memory corruption vulnerability in Qualcomm Snapdragon DSP service caused by improper validation of input parameters across Snapdragon Auto, Compute, Connectivity, Industrial IOT, and Mobile lines. The issue affects multiple Qualcomm products as listed in the ...

PT-2022-10441 · Qualcomm · Snapdragon Connectivity +4

Name of the Vulnerable Software and Affected Versions: Qualcomm Snapdragon affected versions not specified Description: The issue is related to memory corruption in the DSP service due to improper validation of input parameters. This affects various Qualcomm Snapdragon products, including...

多款Qualcomm产品输入验证错误漏洞

A Qualcomm chip is a chip from Qualcomm Incorporated USA. A way of miniaturizing circuits mainly semiconductor devices, but also passive components, etc., and is from time to time fabricated on the surface of semiconductor wafers. An input validation error vulnerability exists in multiple Qualcom...

CVE-2017-18295

Possible buffer overflow if input is not null terminated in DSP Service module in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SDX20...

Buffer overflow

Possible buffer overflow if input is not null terminated in DSP Service module in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SDX20...