CVE-2026-16101

Spoofing an already bonded device can force either RS9116W or SiWx917 to re-pair/bond with a rogue device. See V1 in BLERP paper below...

CVE-2026-16101 forced re-pairing with already bonded device

Spoofing an already bonded device can force either RS9116W or SiWx917 to re-pair/bond with a rogue device. See V1 in BLERP paper below...

CVE-2026-16101

The CVE concerns Silicon Labs RS9116W and SiWx917 wireless components. A spoofed, already bonded device can force re-pairing with a rogue device, effectively re-bonding security associations and potentially granting adjacent attackers high-impact access. The vulnerability stems from improper bond...