CVE-2017-18319

Information leak in UIM API debug messages in snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 800, ...

CVE-2017-18322

Cryptographic key material leaked in WCDMA debug messages in snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD...

CVE-2017-18323

Cryptographic key material leaked in TDSCDMA RRC debug messages in snapdragon automobile, snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9615, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 430, SD 450, SD...

CVE-2017-18323

Cryptographic key material leaked in TDSCDMA RRC debug messages in snapdragon automobile, snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9615, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 430, SD 450, SD...

CVE-2017-18330

Buffer overflow in AES-CCM and AES-GCM encryption via initialization vector in snapdragon automobile, snapdragon mobile and snapdragon wear in versions IPQ8074, MDM9206, MDM9607, MDM9635M, MDM9640, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD...

CVE-2017-18327

CVE-2017-18327 concerns logging of security keys when any WCDMA call is configured or reconfigured on Qualcomm Snapdragon platforms (automotive, mobile, wear) across listed chipsets and SoCs (e.g., MDM9607, MSM8996AU, SD 210/212/205, SD 820/835/845, SDA660, etc.). The NVD entry lists affected pro...

CVE-2017-18328

Use after free in QSH client rule processing in snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 636, SD 820, SD 835, SDA660, SDM630, SDM660,...

CVE-2017-18141

When a 3rd party TEE has been loaded it is possible for the non-secure world to create a secure monitor call which will give it access to privileged functions meant to only be accessible from the TEE in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear in versions IPQ8074, MDM9206,...

CVE-2017-18320

CVE-2017-18320 describes a data abort in QSEE when unloading on a third-party TEE without prior loading, affecting Qualcomm Snapdragon automotive/mobile platforms across numerous SoCs (e.g., MSM8996AU, SD 410/12, 820, 835, 650/52, 710/670, 810, 820A, 835, 660, several SDM/SXR variants). The linke...

CVE-2017-18328

CVE-2017-18328 describes a use-after-free in the QSH client rule processing on Qualcomm Snapdragon mobile/wear platforms (MDM/SDM/SoC families listed). Documented impact is high local vulnerability with potential for complete confidentiality, integrity, and availability compromise if exploited. N...

CVE-2017-18319

CVE-2017-18319 corresponds to an information disclosure in the UIM API debug messages affecting Snapdragon/mobile devices listed (MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/212/205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415,...

CVE-2017-18326

Cryptographic keys are printed in modem debug messages in snapdragon mobile and snapdragon wear in versions MDM9607, MDM9615, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 636,...

CVE-2017-18329

CVE-2017-18329 describes a potential buffer overflow in RTP packet handling on Qualcomm Snapdragon automotive and wearable platforms. Affected are Snapdragon Automotive/Wear devices across listed Snapdragon/HW variants (e.g., MDM9615/9625/9635M/9640/9645/9650/9655, MSM8909W, MSM8996AU, SD 210–SD ...

CVE-2017-11004

A non-secure user may be able to access certain registers in snapdragon automobile, snapdragon mobile and snapdragon wear in versions IPQ8074, MDM9206, MDM9607, MDM9635M, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD...

Design/Logic Flaw

Secure application can access QSEE kernel memory through Ontario kernel driver in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear in versions MDM9206, MDM9607, MDM9650, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 625, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660,...

CVE-2017-18317

Restrictions related to the modem sim lock, sim kill can be bypassed by manipulating the system to issue a deactivation flow sequence in Snapdragon Automobile, Snapdragon Mobile in versions MSM8996AU,SD 410/12,SD 820,SD 820A...

CVE-2017-18318

Missing validation check on CRL issuer name in Snapdragon Automobile, Snapdragon Mobile in versions MSM8996AU, SD 410/12, SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 810, SD 820, SD 820A...

CVE-2018-11996

When a malformed command is sent to the device programmer, an out-of-bounds access can occur in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear in versions MDM9206, MDM9607, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 600, SD 820, SD 820A, SD 835, SDA660, SDX20,...

Buffer overflow

Possible buffer overflow in OEM crypto function due to improper input validation in Snapdragon Automobile, Snapdragon Mobile in versions MSM8996AU, SD 425, SD 430, SD 450, SD 625, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDA845, SDX24, SXR1130...

Buffer overflow

Possible buffer overflow in Ontario fingerprint code due to lack of input validation for the parameters coming into TZ from HLOS in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear in versions MDM9206, MDM9607, MDM9650, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 430, SD 45...