361 matches found
Memory corruption
There is potential for memory corruption in the RIL daemon due to de reference of memory outside the allocated array length in RIL in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables in versions MDM9206, MDM9607, MDM9635M, MDM9650,...
Design/Logic Flaw
While processing radio connection status change events, Radio index is not properly validated in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile and Snapdragon Voice & Music in versions MDM9206, MDM9607, MDM9640, MDM9650, MSM8996AU, ...
CVE-2018-13888
CVE-2018-13888 describes memory corruption in the RIL daemon due to deference of memory outside the allocated array in Snapdragon platform families (e.g., Snapdragon Auto, Mobile, Wearables). Affected components are the RIL daemon implementations across listed Snapdragon SoCs and SKUs. The CVE en...
CVE-2018-11899
While processing radio connection status change events, Radio index is not properly validated in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile and Snapdragon Voice & Music in versions MDM9206, MDM9607, MDM9640, MDM9650, MSM8996AU, ...
CVE-2018-11899
Technical details are not publicly available in the provided documents for CVE-2018-11899; monitor for updates.
CVE-2018-11938
Improper input validation for argument received from HLOS can lead to buffer overflows and unexpected behavior in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT,...
Design/Logic Flaw
Possible undefined behavior due to lack of size check in function for parameter segmentidx can lead to a read outside of the intended region in snapdragon automobile, snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, ...
Buffer overflow
Lack of check of input size can make device memory get corrupted because of buffer overflow in snapdragon automobile, snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD...
Buffer overflow
Lack of checking input size can lead to buffer overflow In WideVine in snapdragon automobile, snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9635M, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625...
CVE-2018-11288
Possible undefined behavior due to lack of size check in function for parameter segmentidx can lead to a read outside of the intended region in snapdragon automobile, snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, ...
CVE-2017-18332
Security keys are logged when any WCDMA call is configured or reconfigured in snapdragon automobile, snapdragon mobile and snapdragon wear in versions MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 71...
CVE-2017-18332
CVE-2017-18332 describes a vulnerability where security keys are logged during WCDMA call configuration on Qualcomm Snapdragon automotive/mobile/wear platforms (MDM9607/MDM9635M/MDM9640/MDM9645/MDM9650/MDM9655, MSM8909W/MSM8996AU, SDx family, etc.). Connected records list affected Qualcomm compon...
CVE-2018-11288
Possible undefined behavior due to lack of size check in function for parameter segmentidx can lead to a read outside of the intended region in snapdragon automobile, snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, ...
CVE-2018-5868
Lack of checking input size can lead to buffer overflow In WideVine in snapdragon automobile and snapdragon mobile in versions MSM8996AU, SD 425, SD 430, SD 450, SD 625, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SDA660, SDX24, SXR1130...
CVE-2018-5915
Exception in Modem IP stack while processing IPv6 packet in snapdragon automobile, snapdragon mobile and snapdragon wear in versions MDM9607, MDM9640, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 430, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SDA660,...
CVE-2018-5868: Improper Restriction of Operations within the Bounds of a Memory Buffer
Lack of checking input size can lead to buffer overflow In WideVine in snapdragon automobile and snapdragon mobile in versions MSM8996AU, SD 425, SD 430, SD 450, SD 625, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SDA660, SDX24, SXR1130...
CVE-2017-18329
Possible Buffer overflow when transmitting an RTP packet in snapdragon automobile and snapdragon wear in versions MDM9615, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 636, SD...
Code injection
QSEE unload attempt on a 3rd party TEE without previously loading results in a data abort in snapdragon automobile and snapdragon mobile in versions MSM8996AU, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 650/52, SD 712 / SD 710 ...
Code injection
Cryptographic key material leaked in TDSCDMA RRC debug messages in snapdragon automobile, snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9615, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 430, SD 450, SD...
Buffer overflow
Possible Buffer overflow when transmitting an RTP packet in snapdragon automobile and snapdragon wear in versions MDM9615, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 636, SD...