399 matches found
Code injection
In QTEE, an incorrect fuse value can be blown in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 820, SD 820A, SD 835, SD 845, SDM429, SDM439,...
CVE-2017-18131
In QTEE, an incorrect fuse value can be blown in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 820, SD 820A, SD 835, SD 845, SDM429, SDM439,...
CVE-2017-18278
An integer underflow may occur due to lack of check when received data length from fontmgrqseerequestservice is bigger than the minimal value of the segment header, which may result in a buffer overflow, in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, SD...
CVE-2017-18157
A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20...
Buffer overflow
Lack of check of buffer length before copying can lead to buffer overflow in camera module in Small Cell SoC, Snapdragon Mobile, Snapdragon Wear in FSM9055, FSM9955, IPQ4019, IPQ8064, MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, MSM8996AU, QCA9531, QCA9558, QCA9563, QCA9880, QCA9886, QCA9980, SD...
Command injection
A new account can be inserted into simContacts service using Android command line tool in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 820, SD 820A, S...
Buffer overflow
While iterating through the models contained in a fixed-size array in the actData structure, which also stores an incorrect number of models that is greater than the size of the array, a buffer overflow occurs in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607,...
Race condition
A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20...
Integer overflow
An integer underflow may occur due to lack of check when received data length from fontmgrqseerequestservice is bigger than the minimal value of the segment header, which may result in a buffer overflow, in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, SD...
CVE-2017-18279
Lack of check of buffer length before copying can lead to buffer overflow in camera module in Small Cell SoC, Snapdragon Mobile, Snapdragon Wear in FSM9055, FSM9955, IPQ4019, IPQ8064, MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, MSM8996AU, QCA9531, QCA9558, QCA9563, QCA9880, QCA9886, QCA9980, SD...
CVE-2017-18275
A new account can be inserted into simContacts service using Android command line tool in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 820, SD 820A, S...
CVE-2017-18274
The CVE-2017-18274 entry describes a buffer overflow in Qualcomm Snapdragon components (Snapdragon Automobile, Mobile, Wear across listed SDMs and processors) caused by iterating through models in a fixed‑size actData array while the reported count is greater than the array size. This is a local ...
CVE-2017-18173
CVE-2017-18173 involves an integer underflow in Snapdragon Mobile when processing an invalid Android verified boot signature with very large length. Affected devices include Qualcomm Snapdragon SoCs such as SD 425, 427, 430, 435, 450, 625, 810, 820, 835, SDM630, SDM636, SDM660 and Snapdragon_High...
CVE-2017-18157
A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20...
CVE-2018-11966
Undefined behavior in UE while processing unknown IEI in OTA message in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables in MDM9150, MDM9206, MDM9607, MDM9640, MDM9650, MDM9655, MSM8909W, MSM8996AU, QCS605, SD 210/SD...
CVE-2018-11958
Insufficient protection of keys in keypad can lead HLOS to gain access to confidential keypad input data in Snapdragon Auto, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music in MDM9206, MDM9607, MDM9650,...
CVE-2018-11958
Insufficient protection of keys in keypad can lead HLOS to gain access to confidential keypad input data in Snapdragon Auto, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music in MDM9206, MDM9607, MDM9650,...
CVE-2018-11271
Improper authentication can happen on Remote command handling due to inappropriate handling of events in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Wearables in MDM9206, MDM9607,...
CVE-2018-11976
ECDSA signature code leaks private keys from secure world to non-secure world in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice &...
Unauthorized Access Vulnerability in Multiple Qualcomm Products
Qualcomm MDM9206 and others are products of Qualcomm Incorporated, U.S.A. The MDM9206 is a central processing unit CPU product.The SDX24 is a modem.The SD 425 is a central processing unit CPU product. An unauthorized access vulnerability exists in Display in multiple Qualcomm products, which stem...