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EUVD-2019-2390

šŸ—“ļøĀ 07 Oct 2025Ā 00:30:54Reported byĀ EUVDTypeĀ 
euvd
Ā euvd
šŸ”—Ā euvd.enisa.europa.eušŸ‘Ā 1Ā Views

Buffer overflow risk in multiple Snapdragon platforms due to unchecked destination buffer size.

Related
Affected
Refs
ReporterTitlePublishedViews
Family
Circl
CVE-2019-10586
5 Mar 202013:13
–circl
CNVD
Data Modem Buffer Overflow Vulnerability in Multiple Qualcomm Products
4 Mar 202000:00
–cnvd
CVE
CVE-2019-10586
5 Mar 202008:56
–cve
Cvelist
CVE-2019-10586
5 Mar 202008:56
–cvelist
NVD
CVE-2019-10586
5 Mar 202009:15
–nvd
Prion
Buffer overflow
5 Mar 202009:15
–prion
RedhatCVE
CVE-2019-10586
22 May 202510:24
–redhatcve
[
  {
    "enisaIdVendor": [
      {
        "id": "8309caab-4263-357c-9482-87db0b4c12f3",
        "vendor": {
          "name": "Qualcomm, Inc."
        }
      }
    ],
    "enisaIdProduct": [
      {
        "id": "c86e1dde-9350-30ae-bab7-7fe9d562fd95",
        "product": {
          "name": "Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables"
        },
        "product_version": "APQ8009, APQ8017, APQ8053, APQ8096AU, APQ8098, MDM9150, MDM9205, MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8905, MSM8909, MSM8909W, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8996AU, MSM8998, Nicobar, QCM2150, QCS605, QM215, Rennell, SC8180X, SDA660, SDA845, SDM429, SDM429W, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SDX20, SDX24, SDX55, SM6150, SM7150, SM8150, SXR1130"
      }
    ]
  }
]

Data

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07 Oct 2025 00:30Current
9.2High risk
Vulners AI Score9.2
CVSS 3.19.8
CVSS 210
EPSS0.00356
1