CVE-2018-11277

2018-09-2013:00:00

qualcomm

www.cve.org

0.0004 Low

EPSS

Percentile

12.6%

JSON

In Snapdragon (Automobile, Mobile, Wear) in version MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SDA660, the com.qualcomm.embms is a vendor package deployed in the system image which has an inadequate permission level and allows any application installed from Play Store to request this permission at install-time. The system application interfaces with the Radio Interface Layer leading to potential access control issue.

CNA Affected

[
  {
    "product": "Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear",
    "vendor": "Qualcomm, Inc.",
    "versions": [
      {
        "status": "affected",
        "version": "MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SDA660"
      }
    ]
  }
]

References

www.qualcomm.com/company/product-security/bulletins

0.0004 Low

EPSS

Percentile

12.6%

JSON

Related for CVELIST:CVE-2018-11277