CVE-2016-2063

2016-08-07T17:59:04
ID CVE-2016-2063
Type cve
Reporter NVD
Modified 2016-11-28T15:03:02

Description

Stack-based buffer overflow in the supply_lm_input_write function in drivers/thermal/supply_lm_core.c in the MSM Thermal driver for the Linux kernel 3.x, as used in Qualcomm Innovation Center (QuIC) Android contributions for MSM devices and other products, allows attackers to cause a denial of service or possibly have unspecified other impact via a crafted application that sends a large amount of data through the debugfs interface.