The vulnerabilities of Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IoT, Snapdragon Industrial IoT, Snapdragon Mobile, Snapdragon Voice & Music, and Snapdragon Wearables software in embedded chips from Qualcomm arise from operations that occur outside of the buffer in memory. This allows attackers to disclose sensitive information or cause system failures.

🗓️ 24 Dec 2022 00:00:00Reported by FSTEC of Russia — Information Security Threat DatabaseType

bdu_fstec

bdu_fstec🔗 bdu.fstec.ru👁 1 Views

Snapdragon software across multiple families has operations outside the memory buffer, enabling data disclosure or service failures.

Reporter	Title	Published	Views	Family All 10
Android Security Bulletins	Pixel Update Bulletin—April 2020Stay organized with collectionsSave and categorize content based on your preferences.	6 Apr 202000:00	–	androidsecurity
Circl	CVE-2019-10574	18 Nov 201919:45	–	circl
CVE	CVE-2019-10574	16 Apr 202010:46	–	cve
Cvelist	CVE-2019-10574	16 Apr 202010:46	–	cvelist
EUVD	EUVD-2019-2378	7 Oct 202500:30	–	euvd
NVD	CVE-2019-10574	16 Apr 202011:15	–	nvd
Prion	Design/Logic Flaw	16 Apr 202011:15	–	prion
RedhatCVE	CVE-2019-10574	22 May 202510:26	–	redhatcve
The Hacker News	Qualcomm Chip Flaws Let Hackers Steal Private Data From Android Devices	14 Nov 201911:00	–	thn
The Hacker News	Qualcomm Chip Flaws Let Hackers Steal Private Data From Android Devices	14 Nov 201911:00	–	thn

Source	Link
cpr-zero	www.cpr-zero.checkpoint.com/vulns/cprid-2172/
nvd	www.nvd.nist.gov/vuln/detail/CVE-2019-10574
docs	www.docs.qualcomm.com/product/publicresources/securitybulletin/october-2022-bulletin.html
web	www.web.nvd.nist.gov/view/vuln/detail

09 Apr 2026 00:00Current

7.6High risk

Vulners AI Score7.6

CVSS 26.2

CVSS 37.1

EPSS0.00059

Snapdragon software memory buffer outside memory buffer data disclosure service failures